SELA
Ellipsiz DSS is a distributor for Sela equipment in the South East Asia and China region for over 18 years. SELA develops and adapts technologies to provide roadmap solutions for physical failure analysis and characterisation. SELA offers a modular suite of tools for cost-effective material and root-cause failure analysis since 1991. Their products incorporate unique technologies and IPs that solve bottlenecks in the failure analysis and sample preparation for wide variety of requirements.
MC600i
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MC600i
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MC600i is a fifth generation version of the award-wining Microcleaving series of the sample preparation systems for cross-section of crystalline materials for following SEM inspection and other analyses.
- Turn-around time drastically reduced
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM imaging
- High productivity
- Low cost of ownership
- Accuracy of full process is down to 100nm in 10 minutes
- Accuracy of fast cleave is down to 3 microns in 3 minutes
- Single die cleaving with dimensions down to 2x1mm
- Wafer and die edge cleaving down to 0.5mm from edge
- Controlled Liquid Nitrogen spraying to improve quality of cross section
- Ease of use – few hours training for new operator
- Automatic processing – no previous experience required
The MC600i system utilizes Microcleaving and Precise Cleaving technologies in two main processes – full process and fast process.
SELA’s Microcleaving and Precise Cleaving technologies are proved themselves as undisputed leaders for accurate, fast and artifact-free sample preparation. The MC600i system achieves fully automatic, reliable and rapid cross sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, automatic off-loading for immediate inspection. High and consistent accuracy and excellent quality of cross-sections significantly reduce diagnostic cycle for failure analysis, characterization and process monitoring.
These features together with high throughput ensuring that sample preparation is never a bottleneck for SEM analysis.
System Highlights:
System Features:
MC20
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MC20
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The SELA set of the MC20 smart micro-cleaving system with capability to register and cleave buried defects is the NEW advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput. The set of the MC20 comprehensive cleaving solution utilized and delivers to customers advanced capabilities of SELA’s micro-cleaving and perfect cleaving technologies.
- Semi-automatic controllable cleaving process for visible and buried targets
- Advanced white light and IR optics
- Registration and cross-section of buried defects
- Observation from top and bottom of the sample
- Microscope with variable magnification up to x1000
- Built-in vacuum
- Edge cleaving – as close as 2 mm (nominal) to wafer edge
- Edge cleaving -as close as 2 mm (nominal) to sample edge
- High throughput without artifacts
- Single die capability
- Maintenance free servicing model
- Turnaround time drastically reduced
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM & FIB utilization
- Improves characterization
- Low Cost of Ownership
- Minimum input sample: 4 x 2 mm
- Accuracy: Better than 5 μm, 2-3 μm with advanced optics
- Throughput: Single minute / sample
The MC20 table top system achieves semi-automatic, reliable and rapid cross-sectioning of wafer segments and dies. Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis. The MC20 features, together with high throughput (single minute per sample), high accuracy (better than 5 microns) and the excellent natural lattice quality of the cross-sections produced, significantly reduce the turnaround time for both failure analysis and process monitoring.
Features:
Benefits:
Micro-cleaving Process:
MC10i
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MC10i
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The SELA set of the MC10i smart micro-cleaving system with capability of liquid nitrogen spraying during cleaving is the NEW advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput. Unique LN2 spraying capability ensures best quality of the cross-section by elimination of pulling out of metals and other materials during cleaving.
- Semi-automatic cleaving process
- Controllable liquid nitrogen spraying during cleaving
- Edge cleaving – as close as 1 mm (nominal) to wafer edge
- Edge cleaving – as close as 0.5 mm (nominal) to sample edge
- Single die capability
- High throughput without artifacts
- Microscope with variable magnification up to x1000
- Built-in vacuum
- Maintenance free servicing model
- Turnaround time drastically reduced
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM & FIB utilization Improves characterization
- Low Cost of Ownership
- Minimum input sample size: 2×1 mm
- Accuracy: Better than 5 µm, 2-3 µm with advanced optics
- Throughput: Single minute / sample
The set of the MC10i delivers to customers comprehensive cleaving solution with advanced capabilities of SELA’s micro-cleaving and perfect cleaving technologies.
The MC10i table top system achieves semi-automatic, reliable and rapid cross-sectioning of wafer segments and dies. Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis.
Features:
Benefits:
Micro-cleaving Process:
PCM
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PCM
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Perfect Cleave Mechanism (PCM) is a simple manual cleaving tool for cross-section of crystalline materials such as Si, GaN, GaAs, InPh, SiC and others.
- Perfect quality of cross-section
- High throughput
- Improves and enhances SEM imaging
- Compact size
- Low cost of ownership
- Perfect quality of cross-section for crystalline materials
- Fast cleaving in less than a minute
- Size of cleaved samples from full wafer and to single die 2x2mm
- Manually controlled accuracy
- Ease of use – – no previous experience required
PCM utilizes SELA’s proprietary Perfect Cleaving technologies to achieve fast cleaving of crystalline materials with perfect quality of cross-section.
The PCM had been presented to semiconductor market and delivered to customers in 2000 as a stand-alone solution for the sample preparation for SEM analysis and as a complementary tool for the initial sample preparation for the automatic microcleaving series of SELA – MC500, MC600 and MC600i systems SELA’s customers recognized great capability of the PCM and utilized it for wide variety of preparation requirements for past 15 years.
PCM is a compact tool and customers use it under magnified glasses and optical stereo microscopes to improve accuracy of cleaving.
System Highlights:
System Features:
Xact200
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Xact200
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Xact200 performs cutting-edge TEM/STEM sample preparation in line with the Semiconductor and Nanotechnology roadmap requirements for next generation physical FA and characterization.
- Unsurpassed quality with negligible artifacts
- Amorphous layer about 1nm on Si
- Routine lamella thinning to below 20nm covering a wide area of interest
- Thinning down to 10nm supporting 1x technology node
- Enhanced lamella thickness uniformity and robustness
- High precision milling with integrated FE SEM/STEM observation
- AIM technology enabled by unique ion milling unit With dynamic Xe ion beam
- Side and Plan view TEM/STEM preparation
- Top and back side Delayering
- SEM cross-section preparation for wide and high structures
- SCM and SSRM preparation
- Preparation of extremely big and extremely small objects
- TSV and bumps SEM and TEM/STEM preparation
- Real time STEM imaging during the milling
- Real time thickness measurement during the milling
- Ease of use
The Xact200 is a second-generation system uniquely combines the disruptive innovative AIM technology with an integrated FE SEM column, in process real time STEM imaging capability and piezo based multi axes eucentric manipulator.
The Xact200 delivers excellent sample quality, significantly reduced turn-around times and enhanced productivity.
AIM, SELA’s proprietary Adaptive Ion Milling technology, is superior to traditional Focused Ion Beam (FIB) and Broad Ion Bean (BIB) technologies in ability to reduce lamella thickness below 15 nanometers over a large area with artifact-free quality, high precision, controlled thickness variation and high throughput.
System Highlights:
System Features:
EM3i
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EM3i
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A dedicated, automated, timesaving and user-friendly system that enable TEM/STEM and SEM sample preparation for both cross section and plan viev in a wide range of application. Featuring a cryo-cooled, dry sawing process, the EM3 system prepares specimens of either crystalline or amourphous materials. The output sample is mounted onto a compatible TEM mount that allows rework.
- Applicable for site-specific and general area
- Enables multiple reworks of TEM specimen
- Interfaces with broad and focused ion milling
- Increases overali throughput
- Improves yield analysis
- Improves characterization
- Low cost of ownership
