Inspection capabilities: outstanding. Footprint: only one sqm.

With its compact dimensions, the Cougar EVO is the perfect choice for X-ray inspection in SMT, the semiconductor industry, and laboratories. Designed as a solution for facilities with space limitations, it combines minimum size and maximum performance. The weight of the Cougar EVO makes it suitable for many standard building floors. In addition, its size and weight make bringing the system into the location quick and hassle-free. In many cases, the existing elevators can be used for transport.

Optimized automated X-ray and CT quality inspections

Cougar EVO responds to the need for improved, automated operation with integrated workflows in the FGUI operating software. The Comet Yxlon FF CT software is designed to start automatically for faster reconstruction and visualization. Due to its unique ability to render 3D cinematic images with a preset selection of transfer functions (TF), the software produces the most realistic, vivid visualization available today.

SMT inspections: grand performance for small devices

Due to the continuous miniaturization of products, more and more components must fit in an ever-smaller area. For the most accurate and repeatable quality inspection results, a test system must not only provide high performance and resolution but also needs to be equipped with dynamic image enhancement filters. The Comet Yxlon Cougar EVO features:

Large flat-panel detectors with up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes

Best laminography with micro3Dslice, optimally suited for large PCBs, with detailed 3D visualization for quick and easy failure analysis – substantially cost-saving compared to micro sectioning

Automatic void calculation with VoidInspect, the laminography workflow enabling the rapid non-destructive analysis of voids inside the solder joints of board components

Integration in the production line: ProLoop (Link auf Video weiter unten) allows direct communication with inline AOI / AXI inspection

Cougar EVO SMT applications

• PCB
  • BTC
  • BGA
  • LGA
  • QFN/QFP
  • THT
• IGBT
• LED

Semicon inspections: maximum resolution at minimum voltage

Electronic components and semiconductor devices are the key elements of most electronic systems. Due to their compactness and density, testing requires maximal image resolution at low power and low voltage. Void compilations, including multi-area voiding, need accurate, repeatable inspection routines. The Comet Yxlon Cougar EVO offers:

• Highly sensitive detector with optional dose reduction
• High detail recognition through an integrated image chain
• Integrated, automatic error detection in FGUI (Bumps, voids)

Cougar EVO semiconductor applications

• Wafers and integrated circuits (IC)
  • Die attach connections
  • 3D IC joints
  • TSV
• Sensors
• MEMS and MOEMS

Laboratory inspections: leading technology for precise analysis

The inspection of electronic components during research and development is highly complex and requires a broad range of features. Computed tomography with the Comet Yxlon Cougar EVO is the technology of choice for detailed analyses of micro components such as those used in batteries, connectors, and medical devices.

Exceptional CT quality due to a range of highly sensitive detectors with an excellent contrast-to-noise ratio

Realistic, vivid visualization by Comet Yxlon FF CT software, the integrated workflow in the FGUI user interface with individual 3D cinematic renderers, artifact reduction, and a preset selection of transfer functions (TF)

Cougar EVO lab applications

• Batteries
• Connectors
• Various hard-to-see electronics components
• Medical material
• Military and space electronics

Production line integration with ProLoop

ProLoop is Comet Yxlon’s smart factory solution for the optimization of production processes. It enables direct communication with the inline AOI / AXI inspection systems and thus helps achieve maximum yield performance.

Technical Data

SMT inspections: grand performance for small devices

Due to the continuous miniaturization of electronic components, more and more features must fit in an ever-smaller area. For the most accurate and repeatable quality inspection results, a test system must not only provide high performance and resolution but also needs to be equipped with dynamic image enhancement filters. The Comet Yxlon Cheetah EVO features:

Large flat-panel detectors with up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes

Best laminography with micro3Dslice, with detailed 3D visualization for quick and easy failure analysis – resulting in substantial cost-savings compared to micro sectioning

Automatic void calculation with VoidInspect CL or DR, the laminography- or radiscopy-based inspection workflows enabling the rapid non-destructive analysis of voids inside the solder joints of board components

THTInspect DR, the semi-automated defect analysis for fill level inspections on THT-based components in 2D

Integration in the production line: ProLoop (Link auf Video weiter unten) allows direct communication with inline AOI / AXI inspection systems

Optional high load capacity (< 20 kg) with reinforced table and mechanics: Several parts and electronic interconnects in fixed packages can be inspected at once – a real-time saver

Cheetah EVO SMT applications

• PCB
  • BTC
  • BGA
  • LGA
  • QFN/QFP
  • THT
• IGBT
• LED

Semicon inspections: maximum resolution at minimum voltage

Electronic components and semiconductor devices are the key elements of most electronic systems. Due to their compactness and density, testing requires maximal image resolution at low power and low voltage. Void compilations, including multi-area voiding, need accurate, repeatable inspection routines. The Comet Yxlon Cheetah EVO offers:

• Highly sensitive detector with optional low dosage mode
• High detail recognition through an integrated image chain
• Integrated, automatic defect detection with FGUI (e.g. voids in bumps)

Cheetah EVO semiconductor applications

• Wafers and integrated circuits (IC)
  • Die attach connections
  • 3D IC joints
  • TSV
• Sensors
• MEMS and MOEMS

Laboratory inspections: leading technology for precise analysis

The inspection of electronic components during research and development is highly complex and requires a broad range of features. Computed tomography with the Comet Yxlon Cheetah EVO is the technology of choice for detailed analyses of micro components such as those used in batteries, connectors, and medical devices.

Exceptional CT quality due to a range of highly sensitive detectors with excellent contrast-to-noise ratio

Realistic, vivid visualization by Comet Yxlon FF CT software, integrated with the FGUI user interface workflows with individual 3D cinematic renderers, artifact reduction, and a preset selection of transfer functions (TF)

Cheetah EVO lab applications

• Batteries
• Connectors
• Various hard-to-see electronics components
• Medical material
• Military and space electronics

Technical Data

Convertible Bell Jar for Small-Scale Production and R&D Applications

Temescal’s BJD-2000 and FC-2000 are versatile evaporation systems that accept a variety of accessories to meet almost any requirement. Engineered for efficient operation and clean room compatibility, these systems combine maximum flexibility with ease of use. The FC-2000 is a fast- cycle, load-locked system that allows the source to remain under vacuum during substrate reloading. The BJD-2000 is non-load-locked.

Convenient Maintenance

The offset pumping port, the hinged door panels, and the swingout source tray are high-value maintenance features in Temescal bell-jar systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for evaporant reloading, cleaning, and maintenance. Access to the water manifold, the bellows-sealed high-vacuum valve, and other pumping system components is also simple and direct.

Key Features

• Non-load-locked BJD-2000 and load-locked FC-2000, both with a single cryopump
• Source tray supports multiple electron beam and resistance sources
• Standard source-to-substrate distance: 19.5″
• S-S distance with optional source well extension collar: 27.5″
• Field upgrade kit allows conversion into an FC-2800 or a BCD-2800

Mid-Sized Coaters for Production and Large-Wafer R&D Applications

The Temscal FC-2800 and BCD-2800 are clean room-compatible coaters that offer high-throughput efficiency and lift-off capability at a source-to-substrate distance of either 34″ (866mm) or 42″ (1076mm). Both systems can be configured for either freestanding or through-the-wall clean room installation, and both support numerous combinations of deposition sources plus a variety of substrate fixtures and feeding, heating, and cleaning options.

Convenient Maintenance

The offset pumping port, the hinged door panels, and the swingout source tray are high-value maintenance features in Temescal systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for evaporant reloading, cleaning, and maintenance. Access to the water manifold, the bellows-sealed high-vacuum valve, and other pumping system components is also simple and direct.

Key Features

• Non-load-locked BCD-2800 and load-locked FC-2800
• Product chamber dimensions: 28″ x 28″ x 28″
• Standard source-to-substrate distance: 34″
• S-S distance with optional source well extension collar: 42″
• Source tray supports multiple electron beam and resistance sources
• 3 cm or 5 cm ion source available in product chamber
• Product and source chamber cryopumps

Ideal for Production Lift-Off, Step-Coverage, and Dual-Sided Coating Applications

The Temscal FC-3800 enables rapid processing of 150mm diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 150mm diameter wafers for lift off or thirty-six 150mm wafers for step coverage. The 38″ x 38″ x 28″ product chamber is pumped by a high throughput 16″ cryopump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10″ cryopump.

Convenient Maintenance

The offset pumping port, the hinged door panels, and the swingout source tray are high-value maintenance features in Temescal systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for evaporant reloading, cleaning, and maintenance. Access to the water manifold, the bellows-sealed high-vacuum valve, and other pumping system components is also simple and direct.

Key Features

• Product chamber dimensions: 28″ high x 38″ x 38″
• 25.5″ diameter source tray
• Standard source-to-substrate distance: 34″
• S-S distance with optional source well extension collar: 38″
• Product and source chamber cryopumps

Load Locked and Optimized for Lift-Off Processes

The Temescal FC-4400 represents our ultimate classic-configuration, high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of thirty 150mm wafers per load via high capacity e-beam evaporation.

The load locked, 44 inch x 44 inch x 28 inch product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. The dual-cryopump option makes it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features

• Product chamber dimensions: 23.5″ high x 44″ x 44″
• 25.5″ diameter source tray
• Standard source-to-substrate distance: 38″
• S-S distance with optional source well extension collar: 42″
• Optional second product and source chamber cryopumps

Ultimate Uniformity in Lift-Off Processes, Optimized for 150mm Wafers

The Temescal UEFC-4900 with Auratus is the compact version of the UEFC-5700. It represents the ultimate mid-sized coater for lift-off processes. The source-to-substrate distance and chamber angles in the UEFC-4900 have been optimized for 150mm wafers and the system supports 25 x 150mm wafers.

The load locked product chamber is pumped by a CTI model CT-500 cryogenic pump. Powerful cryopumps make it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features

• Large capacity: 25 x 150mm
• 40% more wafers with no increase in footprint or power consumption
• Less than 15 minutes to 5E-07 Torr
• 36,500 L/sec pumping
• Significantly less surface area and volume

Ultimate Throughtput in Lift-Off Processes with 150mm or 200mm Wafers

The Temescal UEFC-5700 with Auratus represents our ultimate high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of forty-two 150mm wafers per load via high capacity e-beam evaporation.

The load locked product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. Dual-cryopumps make it possible to pump this large chamber in 10 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features

• Large capacity: 42 x 150mm
• 40% more wafers with no increase in footprint or power consumption
• Less than 10 minutes to 5E-07 Torr
• 44,000 L/sec pumping
• Significantly less surface area and volume

System

• Ultimate Uniformity Production: 150 & 200mm
• Product Chamber Type: conic
• Load Lock to isolate Product Chamber
• Cryopump water L/sec: 44,000
• Pump down time: 1E-06 < 10mins
• E-gun (max pkg): 2 6x25cc PopTops + 1 fixed pocket
• E-gun Power Supply: 6, 12, or 15 kW
• Ion gun: MKII HC
• Max wafer count: Lift off 42x150mm, 21x200mm
• Source to Substrate: std 43”

System Control

• Temescal Control System (TCS), with Auto, Manual modes plus process datalogging
• Security code-based access for multiple classes of users
• TCS-based process variable monitoring (PVM), allowing user to set tolerance alarms for critical process variables
• 17″ high resolution color touch screen interface

E-Beam

• Temescal 4- or 6-pocket Standard or PopTop turret source
• Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
• TemEBeam Contoller: Sweep, Index, Gun & HV

Substrate

• HULA: High Uniformity Lift-off Assembly
• Lift-off dome or dome frame with segments
• Flip tooling: allows for two sided or edge coating
• VAP: Variable Angle Planetary

Vacuum Pumping & Control

• Market leading dry roughing pump >60 cfm (102 m3/h)
• CTI On-Board Cryopumps
• Cryopump temperature monitoring
• Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS

Product Chamber

• Dimensions in inches: 57 conic
• Product chamber cryopump: Dual CT-400 35,000 L/Sec
• Water cooled product chamber walls
• Two sets of product chamber evaporation shields
• Wide-angle viewport on front of system
• Maskless uniformity
• Spare port(s) for RGA or alternate access
• 10” and 12.75” diameter side ports for optional components

Source Chamber

• Source-isolation valve allows product chamber access while source chamber remains under vacuum
• Source chamber cryopump: CT-10 (9,000 L/Sec)
• Source Tray Dimensions in inches: 25.5
• Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
• Wide-angle 4” viewport
• Removable stainless-steel source shields

Water & Air System

• Stainless steel manifold provides cooling water for source and product chamber components
• Separate product chamber circuit for cold and optional hot water
• TCS-controlled auto-blowdown for turret source
• PLC-controlled air manifold

System Wide

• 3 EMO switches
• Standard 19” wide electronics rack on casters
• Surfaces exposed to high vacuum are made of 304 SST

Features

• Suitable for 8"wafer.
• Dry in Dry out
• POD or Manual interface

Features

• Suitable for 8"wafer.
• Dry in Dry out
• Suitable for various Cleanroom ISO

Features

• Suitable for 8"wafer.
• Dry in Dry out
• POD or Manual interface
• CIM Connect Option

Features

• Suitable for 8"wafer.
• Dry in Dry out
• POD or Manual interface
• IPA Dry Included
• CIM Connect Option

WIM 300 provides 2D/ 3D inspection and metrology functions to conduct precise automatic optical inspection on defects for various wafer types.

A new generation that supports multiple-wafer tests with faster scanning and shorter test time, Axis-Tec has developed a SiPh Fully Automated Wafer Level Tester with feature-rich capabilities that is mass production ready to determine defective parts and screen for infant mortalities.

Axis-Tec’s Forefront Automated Wafer Level Tester actif comes with all the built-in features and has high flexibilities that can be integrated with a wide range of optical electrical test instruments or equipment to execute testing applications of O-O (Optical to Optical, E-O (Electrical to Optical) and O-E (Optical to Electrical). The wafer level tester is designed and built with automated passive and active align to enable precise optical peak search and electrical probing positioning.

Features

• High Speed Fiber / Fiber Array Alignment
  • <3 seconds for single alignment
  • <1dB insertion loss
• Precision Handling System
  • Vision alignment in multiple dimensions
  • 6 Axis of freedom probers
• High Integration Flexibility
  • Integrated to various test equipment
  • Expandable to any communication protocol
• Low Cost Capital Investments
  • Competitive Price offer Shorter ROIs