The E4800 Series of Recirculating Heater/Chiller is recommended for a wide range of open and closed-loop temperature control applications. The E4860 is the solution for use with the E3100 and K850WM critical point dryers.

Features

• Precise temperature control
• Quiet, efficient operation
• Proven reliability

Environmental considerations

Increasing pressures on natural resources have resulted in many countries restricting the use of water run to waste for cooling of instrumentation. The E4860 can be used in locations where mains water is not available. Corrosion in closed systems can also be minimised by adding inhibitors and, with suitable additives, temperatures below zero can be maintained. A three-term digital temperature controller ensures ease of use and accuracy.

Temperature control

Many instruments measuring physical properties depend on accurate control of temperature and in some processes optimum temperature is essential. With the E4860, over-cooling (which affects efficiency) is prevented and the water temperature can be accurately controlled over the range -10º to +60°C.

A commonly misunderstood feature of refrigerated systems is in applications where the control temperature is other than at or near room temperature. When the instruments are to be operated at controlled temperatures below ambient, the extraction deteriorates significantly and, as a guide, the compounded change is 4% per degree Celsius. In practice, the refrigerant gas pressure has to be adjusted to optimise the performance at any particular temperature. However, the E48060 incorporate automatic adjustment valves in the systems.

Closed loop

The E4860 is a ‘closed loop’ type and therefore efficiencies are dramatically improved compared with open bath models. The E4860 is simple to set up and to operate – essentially maintenance-free.

Choosing the correct heater/chiller

In order to optimise performance from a heater/chiller system, the correct specification must be selected for a particular application. To cool or heat any instrument or system it is important to obtain the following information from the manufacturer:

* Heat load to be dissipated to water, e.g. for an electron microscope lenses

* Flow rate and size of tubing

* Minimum pressure

With this information, consult the table below and select the appropriate heater/chiller. The basic heat load calculation formula is as follows: flow rate x weight of fluid x specific heat x D T = Heat Extraction.

For use with the Quorum E3100 and K850WM critical point dryers

The E4860 is a recommend option with the E3100 and must be ordered with the K850WM wafer dryer.

The K850WM is a compact, bench-top instrument designed to critical point dry a complete 6″/150 mm wafer. A convenient wafer holder allows rapid transfer and ensures that pre-drying does not occur.

K850WM Large Chamber Critical Point Dryer

The K850WM has built-in heating and water cooling using the E4860 Recirculating Heater/Chiller. This combination will give temperature control of +5°C cooling and +35°C during heating. This ensures the critical point is accurately obtained and avoids excess pressures and temperatures or the need to rely on pressure relief valves to control pressure during the heating cycle.

The K850WM has a vertical chamber which allows top-loading of the specimen (e.g. single wafer). A viewing port in the top plate allows observation of the chamber and wafer during the critical point drying process.

The exchange mechanism is simple to use and ensures the specimen remains under liquid during loading.

The E4860 Recirculating Heater/Chiller and EK3102/EK3102-110V carbon dioxide conditioning system must be ordered with the K850WM.

Specimen handling

6″/100 mm or 8″/150 mm diameter wafers are held in a PTFE holding tray. The tray including wafer is immersed in acetone in order to remove all moisture from the specimen. After dehydration, the wafer and holder are transferred into the pre-cooled specimen chamber using the wafer transfer device. On completion of the critical point drying process, the wafer is removed from the chamber using the transfer device prior to further processing.

Features

• P
• 170 mm diameter chamber – optimised for wafer/MEMS drying
• Vertical chamber with top-loading and bottom draining – ensures specimens do not become uncovered during drying
• Thermoelectric heating – accurate temperature control
• Fine control needle valve pressure let down – precise control
• Temperature monitoring and control with thermal cut-out protection
• Pressure monitoring with safety cut-out for over pressure
• Extended warranty option

The E3100 large chamber critical point dryer has been an industry standard for over 35 years and is used in numerous scanning electron microscopy (SEM) laboratories around the world. Primarily used for critical drying of biological and geological specimens, the E3100 can also used for the controlled drying MEMs,  aerogels and hydrogels.

Features

• Proven reliability – over 6,000 critical point dryer installations world-wide
• Simple robust construction – easy to maintain – many critical point dryer users carry out their own routine maintenance
• Horizontal chamber and large viewing window – excellent visibility of the fluid level and drying process
• Safety – the design has been independently type tested to proof pressures in excess of the working pressure and bursting disc rupture pressure
• Specimen handling – optional specimen holders for coverslips and TEM grids. Porous pots are available for fragile or very small specimens
• Extended warranty option

E3100 Critical Point Dryer

The E3100 large chamber critical point dryer has been an industry standard for over 35 years and is used in numerous scanning electron microscopy (SEM) laboratories around the world. Primarily used for the critical point drying biological and geological specimens, the E3100 can also used for the controlled drying of MEMs, aerogels and hydrogels.

The design of the E3100 features a large, horizontal pressure chamber measuring 63.5 mm internal diameter x 82 mm in length. The chamber has an external water jacket for temperature control and specimens are introduced via a removable rear door. The front of the chamber is fitted with a 25 mm diameter window which gives an unsurpassed view of the liquid level during the critical point drying process.

Temperature control

Dial gauges display pressure in the chamber and the temperature of water circulating through the jacket. Three pressure valves permit easy connection to the liquid CO2 cylinder and allow liquid agitation and venting of the chamber.

A source of hot running water is essential. Cooling is also useful, especially for sequential critical point drying process runs and/or in laboratories where the room temperature may be high.

The temperature of the E3100 chamber is raised with a hot water supply. Mains water can be used but a more elegant method involves the use of the optional E4860 Recirculating Heater/Chiller which can be used to pre-cool the chamber to below ambient temperature prior to loading specimens and then to heat the chamber to the critical temperature.

Safety

Operator safety is of course an important consideration with all pressure vessels. If during the critical point drying process the pressure and temperature are inadvertently exceeded, a safety bursting disc is incorporated in the chamber support. The design has been independently type-tested to proof pressures in excess of the working pressure and bursting disc rupture pressure.

Specimen holder (boat)

An important feature is the design of the E3100 transfer boat. This permits specimens in the intermediate fluid to be transferred to the chamber of the critical point dryer. On sealing the chamber, the intermediate fluid begins to drain and can be replaced with liquid CO2. In this way the specimens are never allowed to dry out during the loading and transfer stage of the critical point drying process.

The E3100 is supplied with the E3100-01 tissue boat which has three slots each with three tissue baskets, making a total of nine.

The K850 combines versatility and ease of operation. Built-in thermo-electric heating and adiabatic cooling allow precise temperature control. The vertical pressure chamber (32 mm diameter x 47 mm) has a side viewing port, which gives a clear view of the liquid meniscus during filling. A magnetic stirrer ensures optimal mixing and exchange of process fluids.

The K850 Critical Point Dryer is fitted with thermo-electronic heating and adiabatic cooling and temperature control of +5°C cooling and +35°C during heating. This allows pre-cooling of the chamber and ensures that the critical point is accurately obtained.

The K850 is fitted with three valves: fluid inlet, flushing and a gas venting system which uses a fine needle valve to give controlled pressure let down at the end of the critical point drying process.

A built-in magnetic stirrer ensures thorough mixing of specimens with circulating fluids.

Specimen holders

The standard specimen holder has 12 individual wells (8 mm diameter x 8 mm high) and allows easy exchange and transfer to and from the K850. For larger specimens the optional EK4150 bulk specimen holder (a single large specimen container) is recommended.

For critical point drying very small or delicate specimens the optional CPD800A porous pots are available.

Features

• Vertical chamber with top filling and bottom draining
• Side viewing port – good visibility
• Built-in adiabatic cooling and thermoelectric heating – accurate temperature control
• Fine-control needle valve pressure let down – precise control of decompression avoids potential damage to specimens by uncontrolled pressure release
• Built-in magnetic stirrer- enhanced solvent exchange
• Pressure monitoring with safety cut-out for over pressure
• Extended warranty option

Features

• Automated control offering repeatable outcomes with minimal user intervention
• Built-in adiabatic cooling for fast cool down rates allowing for more throughput
• Easy-to-use and flexible software allowing for quick set-up of profiles
• Status display to indicate time remaining
• Process driven, with individual user profiles for quick set-up time
• Supplied with pre-set profiles covering different sample types allowing easy start for new samples
• Screw top chamber for easy sample loading
• Large viewing window ensuring observation of process flow
• Small footprint ideal for use in fume hoods

Designed with simplicity in mind, the easy-to-use MiniQ GD allows for surface modification of TEM grids. Resulting in the clear imaging of macromolecules.

Features

• Simple operation
• Robust touch panel
• Small footprint
• Automatic operation with minimal user intervention required
• Detachable chamber with implosion guard allowing for easy cleaning
• Pre-set profiles with single touch operation

The GloQube® Plus is a cost-effective, compact and easy to use glow discharge system, designed to fulfil the needs of laboratories with TEM.

The primary application of the GloQube® Plus is to modify the surface of TEM grids in a way that it meets requirements for successful imaging of a variety of macromolecules. Integrated into one system, the two chambers enable the user

maximum flexibility to choose which sample preparation technique they want to use: glow discharge in-air or in-chemical vapour, without downtime for cleaning or the risk of contamination and loss of samples.

The in-chemical vapour glow discharge doesn’t just help with retaining molecules on the TEM grids, but it also allows the user to control the orientation and conformation. With automatic vapour control, the system ensures accurate concentrations of chemical vapour in the plasma, producing reliable and reproducible results.

Two chambers designed into one easy to use package provides a smaller footprint for the workflow space and no cross-contamination between the chambers.

Features

• Short in-air cycle time
• Second chamber for separating in-air and in-vapour processes
• No cross-contamination between chambers due to post-process flush cycle
• Automatic vapour delivery ensures reliable and reproducible results
• Purge cycles reduce water vapour and oxygen concentrations, ensuring excellent yield of specifically orientated macromolecules
• Adjustable slow vent time to minimise sample disturbance
• Optional fast vent for rapid process times
• Safe handling of reagent
• Three level adjustable height sample stage ensures repeatable results

Recommended applications: 

• Hydrophilisation and cleaning of TEM grids carbon support films* for better sample spreading
• Improved adhesion and orientation of proteins, nucleic acids and antibodies
• TEM grid preparation for nanoparticle studies

* Typically: Formvar®, Lacey Carbon, Holey Carbon, Continuous Carbon, Quantifoil®

Key features

• Automatic control of vapour and air introduction
• Flush and purge cycles of vapour chamber and gas line
• Two chambers for separate in-air and in-vapour processes without contamination* * Only one chamber can be used at a time
• Fully automatic
• Loaded with typical standard recipes
• Password protected user profiles and programmable user recipes
• Negative and positive discharge modes
• Single door for easy sample loading
• Adjustable three height sample stage
• Intuitive touch screen control
• Safe vapour delivery using septum-sealed vials
• Automatic valving between chambers to prevent cross-contamination
• Fast and/or soft venting options
• Extended warranty option

Suitable for multi-layer sequential sputtering of two materials, the Q300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets.  When not in use the targets are shuttered for protection from contamination.

Features

• Capable of achieving vacuum of 5 x 10^-5 mbar
• New touch and swipe capacitive screen
• USB port for upgrades and download of process log files
• Multiple-user profiles can be set up on one machine
• New software sorts recipes per user according to recent use
• 16GB of memory can store more than 1000 recipes
• New multi-colour LED visual status indicator
• Interchangeable stage options
• Two sputter heads for large area deposition of different materials
• Single head selection for small samples

Recommended applications for the Q300T D Plus:

• Ideal for multi-layer coating
• Adhesion studies

These products are for Research Use Only. 

New user interface has been thoroughly updated:

• Dual-core ARM processor for a fast, responsive display

• Capacitive touch screen is more sensitive for ease of use

• User interface software has been extensively revised, using a modern smartphone-style interface

• Comprehensive context-sensitive help

• USB interface allows easy software updates and backing up/copying of recipe files to USB stick

• Process log files can be exported via USB port in .csv format for analysis in Excel or similar.  Log files include date, time and process parameters.

• 16GB of flash memory can store more than

1000 recipes

• Quick and easy creation of process sequences with a simple copy, drag and drop operation

Allows multiple users to input and store coating recipes. New feature to sort recipes per user according to recent use.

System prompts user to confirm target material and it then automatically selects appropriate parameters for that material

Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.

Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.

Detachable chamber with built-in implosion guard

Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.

Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.

Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.

Dual head sputtering – for sequential sputtering

The Q300T D Plus has two independent sputtering heads to allow sequential sputtering of two different metals without the need to ‘break’ vacuum, for example, a thin ‘seeding’ layer of chromium (Cr) followed by deposition of gold (Au). An automatic shutter mechanism enables cleaning of oxidising sputter targets and protects the second target and substrate during coatings. For single metal applications one target can be selected.

Multiple stage options

The Q300T D has substrate stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except the rotary planetary stage). A swinging arm stage drive is supplied as standard, which is a stage drive and positioning mechanism that positions the stage under the correct target. Rotation speed is variable between 14-38 rpm:

In addition a flat, adjustable stage capable of accepting 4” (101.6 mm) wafers is supplied as standard with the Q300T D Plus.

As an accessory, a 6” wafer stage is available, which is a flat adjustable stage capable of accepting 6” or 150 mm wafers. The stage includes two masks for improving uniformity of coating.

Rotation stage – 50 mm Ø. This stage only rotates and has no tilt or height adjustment.

Rotate-tilt stage – 50 mm Ø. With height adjustment (target to stage height variable between 30-80 mm). The tilt angle can be pre-set (horizontal to 30°).

Rotation stage for glass slides – 25mm x 76mm

Safety

The Q300T D Plus meets key industry CE standards

• All electronic components are protected by covers

• Implosion guard prevents user injury in event of chamber failure

• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened

• Overheating protection shuts down power supply

Vacuum control

High vacuum turbo pumping allows sputtering of a wide range of oxidising and non-oxidising metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation.  However, this is not suitable for some applications because it can heat the substrate and result in damage when the plasma interacts with the substrate. The Q series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your substrate is protected and uniformly coated.

The Q300T D Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. It is fitted with gold (Au) and chromium (Cr) sputter targets as standard.

Pulsed cleaning for aluminium sputtering

Aluminium (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T D Plus has a special recipe for aluminium that reduces the oxide removal time and prevents excessive pre-sputtering of the target.

Film thickness monitor

The Q300T D Plus can be fitted with an optional dual film thickness monitor (FTM), which measures the coating thickness on two quartz crystal monitors located within the chamber. The thickness measured on the monitor can be correlated to the thickness on the substrate using a mathematical formula built into the software; this allows the user to control the thickness of material deposited on to the substrate. For example, the Q300T D Plus can automatically terminate a coating profile when the required thickness has been achieved. Alternatively, the process can be terminated by time.

The Q300T T Plus is a large chamber, turbo-pumped coating system, ideally suited for sputtering a single large diameter specimen up to 8″/200mm or multiple smaller specimens over a similar diameter. Ideal for thin-film applications and SEM/FE-SEM. It is fitted with three sputtering heads to ensure even deposition of individual large specimens or multiple specimens.

NB: Please note it is not possible to sequentially sputter three different sputtering metals from each sputtering head – for sequential coating see the Q300T D Plus. 

Features

• Ultimate vacuum of 5 x 10^-5 mbar or less possible
• New touch and swipe capacitive screen
• USB port for upgrades and download of process log files
• Multiple-use profiles can be set up on one machine
• New software sorts recipes per user according to recent use
• 16GB of memory can store more than 1000 recipes
• New multi-colour LED visual status indicator
• Interchangeable stage options
• Three sputter heads for larger area deposition of different materials

Recommended applications for Q300T T Plus:

• Wafer Inspection
• Multiple sample preparation for SEM

These products are for Research Use Only. 

Detachable chamber with built-in implosion guard

Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.

Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.

Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.

Triple Target Sputtering System

The Q300T T Plus is fitted with three individual sputtering heads to ensure even deposition of individual large specimens or multiple specimens. For economical coating of small specimens, ‘single target’ mode can be selected. They are ideal coaters for the preparation of large specimens for examination by SEM, FEG-SEM. To ensure even deposition, the Q300 Plus series of coaters are fitted with a rotating specimen stage and three individual magnetron target assemblies, which enhance the efficiency of the process by using low voltages.

Multiple stage options

The Q300T T Plus has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and the rotation speed is variable between pre-set limits.

Flat rotation stage for 200 mm/8” and 150 mm/6” wafers (fitted as standard).

Safety

The Q300T T Plus meets key industry CE standards

• All electronic components are protected by covers

• Implosion guard prevents user injury in event of chamber failure

• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened

• Overheating protection shuts down power supply

Vacuum control

High vacuum turbo pumping allows sputtering of a wide range of oxidising and non-oxidising metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation.  However, this is not suitable for electron microscopy applications because it can heat the sample and result in damage when the plasma interacts with the sample. The Q series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.

The Q300T T Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. The Q300T T Plus is fitted as standard with a chromium (Cr) sputter target. Other targets options include; Au, Au/Pd, Pt/Pd, Pd, Pt, Cu, Ir, W, ITO and Al etc.

Pulsed cleaning for aluminium sputtering

Aluminium (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T T Plus has a special recipe for aluminium that reduces the oxide removal time and prevents excessive pre-sputtering of the target.

Film thickness monitor     

The Q300T T Plus can be fitted with an optional film thickness monitor (FTM), which measures the coating thickness on a quartz crystal monitor within the chamber, in order to control the coating thickness of material deposited on to the sample.

The Q150 GB is a modular glove box version of the highly successful Q150T ES Plus bench top turbomolecular-pumped coating system – suitable for SEM, TEM and many thin-film applications. The Q150 GB comes as standard with sputtering and carbon rod evaporation inserts and a rotating specimen stage. Options include metal evaporation, glow discharge, film thickness measurement and special stages to suit a range of specimen types.

Based on the market-leading Q150T Plus coater, the Q150 GB is single platform for both sputtering and carbon rod evaporation. Metal evaporation using filament or boat sources is also possible using an optional insert.

Depending upon user preference, the Q150GB can be a top-of-the-range sputter coater for high resolution scanning electron microscopy (SEM), or a high vacuum carbon coater suitable for SEM and transmission electron microscopy (TEM). The flexibility of the Q150 GB can be further expanded using a range of optional accessories.

The Q150 GB can sputter both oxidising and non-oxidising metals making it ideal for many thin film applications.
The Q150 GB has an integral turbomolecular pump and additionally requires a suitable rotary pump or dry pump to “back” the turbomolecular pump. See: Ordering Information for details.

Features

• Modular construction for mounting in glove boxes
• Integral glove box pressure monitoring
• Remote operation from a touch screen control panel
• Metal sputtering and carbon evaporation in one system
• High vacuum turbo pumping – allows sputtering of a wide range oxidising and non-oxidising metals
• High vacuum carbon rod coating – ideal for SEM and TEM carbon coating applications (carbon fibre available as an option)
• Vacuum shut down feature – leaves the process chamber under vacuum when not in use improved vacuum performance
• Thick film capabilities – up to 60 minutes sputtering time without breaking vacuum
• Integral pressure interlock switch – automatically turn off pumping if pressure becomes too high
• Extended warranty option

The Q150T Plus is optimised for use with a turbomolecular pump, which gives a lower vacuum down to 5 x 10^-5 mbar. This enables the sputtering of oxidising metals, which have a lower grain size suitable for high-resolution imaging. Similarly, lower scattering allows for high purity, amorphous carbon films of high density.

Features

• New touch and swipe capacitive screen
• USB port for upgrades and download of process log files
• Multiple-user profiles can be set up on one machine
• New software sorts recipes per user according to recent use
• 16GB of memory can store more than 1000 recipes
• New multi-colour LED visual status indicator
• Capable of achieving vacuum of 5 x 10 ^-5 mbar

The Q150T Plus is available in three configurations:

• Q150T S Plus –  an automatic sputter coater for non-oxidising metals. Sputtering targets include; Cr, Ir, W, ITO, Al           other targets available
• Q150T E Plus  –  an automatic carbon cord coater for SEM applications such as EDS and WDS.Metal evaporation/aperture cleaning option available.
• Q150T ES Plus –  a combined system system capable of both sputtering and carbon coating. The deposition heads can be swapped in seconds.

Metal evaporation/aperture cleaning option available.

Recommended applications for Q150T Plus:

•  High-resolution magnification SEM

•  Protective platinum layers for FIB

•  R&D of corrosion-, friction-, and wear protective layers

•  Protective layers on medical devices

•  BSE imaging

•  EDX, WDS, EBSD analysis

•  Carbon coating of replicas

These products are for Research Use Only. 

New user interface has been thoroughly updated:

• Capacitive touch screen is more sensitive for ease of use
• User interface software has been extensively revised, using a modern smartphone-style interface
• Comprehensive context-sensitive help screen
• USB interface allows easy software updates and backing up/copying of recipe files to USB stick
• Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and process parameters
• 16GB of flash memory can store more than 1000 recipes
• Dual-core ARM processor for a fast, responsive display

Allows multiple users to input and store coating recipes, with a new feature to sort recipes per user according to recent use.

Intelligent system logic automatically detects which insert is in place and displays the appropriate operating settings and controls for that process.

The system prompts the user to confirm the target material and it then automatically selects appropriate parameters for that material.

Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience, a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.

Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.

Automatic, controlled pulsed carbon cord evaporation

Careful evaporation allows precise control of carbon thickness (with or without the optional film thickness monitor). The quality of the resulting carbon films is also enhanced by the eradication of “sparking” that is a common feature of less advanced coaters.

For reproducible high-quality carbon films, we would recommend the use of shaped carbon rods. Rods are higher purity, less susceptible to debris and easier to control. Pulsed and ramped carbon rod recipes are supplied as standard.

Multiple stage options

The Q150T Plus has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except for the rotary planetary stage).

Some examples:

• Rotation stage (supplied as standard): 50 mm Ø can accommodate six standard stubs. Height can be pre-set.
• Rotate-tilt stage for improved uniform coating: 50 mm Ø. Tilt and height can be pre-set.
• Variable angle, rotary planetary stage for heavily contoured samples.
• Large flat rotation stage with offset gear box for 4”/100 mm wafers.
• Rotation stage for glass microscope slides.

Other options are available on request. 

Safety

The Q150T Plus meets key industry CE standards

• All electronic components are protected by covers
• Implosion guard prevents user injury in event of chamber failure
• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened
• Electrical interlocks remove power when source head cover opened
• Overheating protection shuts down power supply

The Q150R Plus is suitable for use with Tungsten/LaB₆ SEM and Benchtop SEM.

Recommended for magnifications:

• up to x 50k using Au, Au/Pd
• up to x 100k using Pt (optional)

Carbon cord coating for elemental analysis using the Q150R E & ES Plus.

Features

• Capable of achieving vacuum of 2 x 10^-2 mbar
• New touch and swipe capacitive screen
• USB port for upgrades and download of log files
• Multiple-user profiles can be set up on one machine
• New software sorts recipes per user, according to recent use
• 16GB of memory can store more than 1000 recipes
• New multi-colour LED visual status indicator
• Interchangeable stage options and plug-in heads

The Q150R Plus is available in three configurations:

• Q150R S Plus – an automatic sputter coater for non-oxidising metals. Available sputtering targets including gold, gold/palladium and platinum. 
• Q150R E Plus – an automatic carbon cord coater for SEM applications such as EDS and WDS.
• Q150R ES Plus – a combined system system capable of both sputtering and carbon coating. The deposition heads can be swapped in seconds.

Recommended applications for Q150R Plus:

• Low and medium magnifications
• SE signal boost (improved SE yield) when coating with as litte as 1nm or less of Au, Au/Pd, Pt
• Table-top SEM coating
• Elemental analysis
• Copper metallisation layers for SEM

These products are for Research Use Only. 

New user interface has been thoroughly updated:

• Capacitive touch screen is more sensitive for ease of use
• User interface software has been extensively revised, using a modern smartphone-style interface
• Comprehensive context-sensitive help screen
• USB interface allows easy software updates and backing up/copying of recipe files to USB stick
• Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and process parameters.
• 16GB of flash memory can store more than 1000 recipes
• Dual-core ARM processor for a fast, responsive display

Allows multiple users to input and store coating recipes, with a new feature to sort recipes per user according to recent use.

Intelligent system logic automatically detects which insert is in place and displays the appropriate operating settings and controls for that process.

System prompts user to confirm target material and it then automatically selects appropriate parameters for that material.

Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already  stored but also allows the user to create their own.

Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.

Automatic, controlled pulsed carbon cord evaporation

The carbon evaporation process can be terminated using the optional film thickness monitor, which incorporates a quartz crystal monitor. This recipe ensures that carbon is evaporated in short controlled pulses,  which  has two effects; protecting the sample from heating and ensuring the accuracy of the film thickness monitor. Pulsing also significantly reduces the amount of debris (including large carbon fragments) associated with traditional carbon “flash” evaporation. Pulsed and ramped carbon rod recipes are supplied as standard.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and  sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for electron microscopy applications because it will heat the sample and can result in damage when the plasma interacts  with the sample. The Q series uses low temperature enhanced-plasma magnetrons optimised for the rotary pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.

The Q150R S Plus and Q150R ES Plus use easy-change, 57 mm diameter, disc-style targets which are designed to sputter non-oxidising (noble) metals – ideal for W-SEM applications. The Q150R S Plus and Q150R ES Plus are fitted as standard with a gold (Au) sputter target.

Other targets options include; Au/Pd, Pt/Pd, Pd, and Cu. Platinum (Pt) can also be sputtered with the optional Pt coating vacuum hose assembly.

Interchangeable plug-in heads

This allows the user to configure the system as a sputter coater, evaporator or glow discharge system – all in one space saving format. A carbon cord evaporation insert is available as an option. Automatic detection of the head type when changed.

Detachable chamber with built-in implosion guard

Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.

Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.

Tall chamber option is available for carbon evaporation to avoid sample heating, to improve uniformity for sputtering and to hold taller samples.

Multiple stage options

The Q150R Plus has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except for the rotary planetary stage). Some examples:

• Rotation stage (supplied as standard): 50 mm Ø can accommodate six standard stubs. Height can be pre-set.
• Rotate-tilt stage for improved uniform coating: 50 mm Ø. Tilt and height can be pre-set.
• Variable angle, rotary planetary stage for heavily contoured samples
• Large flat rotation stage with offset gear box for 4”/100 mm wafers
• Rotation stage for glass microscope slides

Other options are available on request.

Safety

The Q150R Plus meets key industry CE standards

• All electronic components are protected by covers
• Implosion guard prevents user injury in event of chamber failure
• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened
• Electrical interlocks remove power when source head cover opened
• Overheating protection shuts down power supply

The Q150V Plus is optimised for high-vacuum applications, with an ultimate vacuum of 1 x 10^-6 mbar. Together with the use of a wide-range Penning/Pirani gauge, this enables the sputtering of oxidising metals with ultra-fine grain sizes, which are suitable for high resolution imaging. The lower background pressure removes oxygen nitrogen and water vapour from the chamber, avoiding chemical reactions during the sputter process, which could otherwise lead to impurities or defects in the coatings. Similarly, lower scattering allows for high purity, amorphous carbon films of high density.

The Q150V Plus offers all the benefits of the Q150T Plus, but with a finer grain size and thinner coating, for ultra-high-resolution applications (above x 200,000 magnification).

Features

• Ultimate vacuum of 1 x 10^-6 mbar
• New multi-colour LED visual status indicator
• 16Gb of flash memory can store more than 1000 recipes
• New software sorts recipes per user according to recent use
• Multiple-user profiles can be set up on one machine
• New touch and swipe capacitive screen

The Q150V Plus is available in three configurations:

• Q150V S Plus –  an automatic sputter coater for oxidising metals with ultra-fine grain size. Available sputtering targets include chromium, iridium and all noble metals
• Q150V E Plus – an automatic carbon coater (rod/cord) for TEM applications. For carbon coating TEM grids. 
• Q150V ES Plus – a combined system capable of both sputtering and carbon coating. The deposition head inserts can be swapped in seconds. Metal evaporation/aperture cleaning option available. 

Recommended high-vacuum applications for Q150V Plus

• Ultra-high-resolution magnification SEM
• Carbon coating of TEM grids
• Protective platinum layers for FIB
• R&D of corrosion-, friction-, and wear- protective layers
• Protective layers on medical devices
• BSE imaging
• EDX, WDS, EBSD analysis
• Carbon coating of replicas
• Nano-technology e.g. Zeolites, polymer nanobrushes

These products are for Research Use Only. 

New user interface has been thoroughly updated:

• Capacitive touch screen is more sensitive for ease of use
• User interface software has been extensively revised, using a modern smartphone-style interface
• Comprehensive context-sensitive help screen
• USB interface allows easy software updates and backing up/copying of recipe files to USB stick
• Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and    process parameters.
• 16GB of flash memory can store more than 1000 recipes
• Dual-core ARM processor for a fast, responsive display

Allows multiple users to input and store coating recipes, with a new feature to sort recipes per user according to recent use.

Intelligent system logic automatically detects which insert is in place and displays the appropriate operating settings and controls for that process.

System prompts user to confirm target material and it then automatically selects appropriate parameters for that material.

Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating recipes are already stored but also allows the user to create their own.  Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.

Automatic, controlled carbon rod evaporation for TEM applications

Careful evaporation allows precise control of carbon thickness (with or without the optional film thickness monitor). The quality of the resulting carbon films is also enhanced by the eradication of “sparking” that is a common feature of less advanced coaters.

For reproducible high-quality carbon films, we would recommend the use of shaped carbon rods. Rods are higher purity, less susceptible to debris and easier to control. Pulsed and ramped carbon rod recipes are supplied as standard.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and  sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for electron microscopy applications because it will heat the sample and can result in damage when the plasma interacts  with the sample. The Q150V Plus series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.

The Q150V S Plus and Q150V ES Plus use easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. The Q150V S Plus and Q150V ES Plus are fitted as standard with a chromium (Cr) sputter target. Other targets options include: Au, Au/Pd, Pt/Pd, Pd, Pt, Cu, Ir, W, ITO and Al.  Others are available on request.

Pulsed cleaning for Al sputtering

Aluminium (Al) rapidly forms an oxide layer, which can be difficult to remove, but the ES & S Plus have special recipes for aluminium that reduce the oxide removal time and prevent excessive pre-sputtering of the target.

Interchangeable plug-in heads

This allows the user to configure the system as a sputter coater, evaporator or glow discharge system – all in one space saving format. A carbon cord evaporation insert is available as an option. Automatic detection of the head type when changed.

Detachable chamber with built-in implosion guard

Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.

Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.

Tall chamber option is available for carbon evaporation to avoid sample heating, to improve uniformity for sputtering and to hold taller samples.

Multiple stage options

The Q150V Plus has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except for the rotary planetary stage).

Some examples:

• Rotation stage (supplied as standard): 50 mm Ø can accommodate six standard stubs. Height can be pre-set.
• Rotate-tilt stage for improved uniform coating: 50 mm Ø. Tilt and height can be pre-set.
• Variable angle, rotary planetary stage for heavily contoured samples.
• Large flat rotation stage with offset gear box for 4”/100 mm wafers.
• Rotation stage for glass microscope slides.

Other options are available on request. 

Safety

• The Q150V Plus meets key industry CE standards
• All electronic components are protected by covers
• Implosion guard prevents user injury in event of chamber failure
• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened
• Electrical interlocks remove power when source head cover opened
• Overheating protection shuts down power supply

The MiniQS is ideally suited to the budget-conscious user who also demands reproducible results in an easy-to-use instrument. The MiniQS uses a Magnetron sputtering head with a simple to replace disc target.

Features

• Pre-set profiles with single-touch operation
• Sputter head is hinger for easy operation
• Fitted with safety interlocks
• Detachable chamber with implosion guard and top-plate allowing for easy cleaning
• Users can rapidly change the chamber to avoid cross-contamination
• Automatic operation with minimal user intervention required
• Compact sized; ideal for use benchtop SEMs
• Range of noble target options to suit majority of applications, including forensics
• Possibility of coating samples to 50mm diameter

The Coolstage is a Peltier-driven SEM cooling stage for scanning electron microscopy (SEM), low vacuum (LV) or variable pressure (VP) applications. The stage can be cooled to sub-zero temperatures for specimens that may be sensitive at ambient temperature, subject to beam damage, or may otherwise ‘sublime’ (lose water) at ambient temperatures.

Three products

There are three versions of Coolstage: Standard, Enhanced and Ultra, designed to cover differing specimen requirements.

The Standard Coolstage consists of a single stage Peltier device, onto which a thermally isolated specimen holder and dual temperature sensor is mounted. The Coolstage assembly is mounted onto the SEM stage using an adaptor plate specific to the microscope. Cooling pipes and electrical wires connect to the SEM feedthrough flange. External components are a recirculating water chiller power supply case and a compact keypad for digital temperature readout and control.

Alternative products in the Quorum range:

• For lower temperatures than Peltier cooling can give? The PP3005 SEMCool offers close-to liquid nitrogen temperatures (down to -190°C)
• For liquid nitrogen temperature cooling with a specimen load-lock? Please see: PP3006 CoolLok
• For a full low temperature cryo preparation system for SEM and FIB/SEM (including rapid freezing, vacuum transfer, cold fracturing, sublimation and sputtering) please see: PP3010T.

Compact, efficient cooling and temperature control

The temperature range of the Standard Coolstage is -30°C to +50°C at 300 Pa. The specimen holder is water-cooled using a small, self-contained closed loop recirculating chiller that is normally positioned approx 2m from the SEM. A microprocessor controls and monitors the temperature of the cold stage. A small keypad is used to set the required temperature and display target and current temperatures.

The specimen holder has been designed to minimise image drift due to temperature change, giving a stable image at high magnification. An integrated RS-232 interface allows temperature to be set and read from the SEM.

Rapid specimen exchange

To exchange a specimen it is necessary to increase the specimen stage temperature to ensure that condensation does not form on the specimen or specimen stage. The keypad controller has a convenient ‘exchange’ button that will automatically take the specimen holder temperature to a programmable temperature from between +5ºC to +20ºC. Typical cooling and heating rates are up to 30ºC per minute.

When not in use, the major parts of the system can be left in situ and the cooling stage is very easily removed when reverting to ‘normal’ use. A convenient storage block is provided for Coolstage stage assembly and vacuum feedthrough for when the system is not in use.

Features

• Temperature range -30°C to +50°C at 300 Pa
• Self contained cooling – no additional external cooling water needed
• Temperature accuracy +/- 1.5°C or 2% – whichever is greater
• Minimal image drift
• Cooling and heating rates of up to 30°C per minute
• Keypad control – with simultaneous display of actual and target temperature
• Supplied with SEM chamber port feed-though – specify when ordering

The SEMCool is based on the PP3006 CoolLok but without the PP3004 QuickLok components. It is designed for cryogenic applications where airlock exchange of specimens into the microscope is not required.

Features

• Temperature range down to -190°C
• Off-column cooling with all-day runtime between fills
• Independent cooling of cold stage and cold trap
• Upgrade path to PP3006 CoolLok
• Extended warranty option

The PP3006 CoolLok offers rapid transfer and cryo temperature observation of specimens for SEM, FIB/SEM, beamline or other vacuum systems. Applications include thermal protection of beam-sensitive specimens and low temperature observation of materials such as plastics, polymers low-K dielectrics and hard-soft mixtures. The system can also be used for inert gas transfer of ambient temperature specimens from a glove box.

Features

• Rapid specimen exchange
• Temperature range down to -190°C
• Off-column cooling with all-day runtime between fills
• Independent cooling of cold stage and cold trap
• Vacuum or inert gas (glove box) transfer
• Rapid specimen freezing option 24425
• Cryo workflow options
• Extended warranty option

The PP3010 is a highly automated, easy-to-use, column-mounted, gas-cooled cryo preparation system suitable for most makes and models of SEM, FE-SEM and FIB/SEM.

The PP3010 has all the facilities needed to rapidly freeze, process and transfer specimens. The cryo preparation chamber is turbomolecular pumped and includes tools for cold fracturing, controlled automatic sublimation and sputter coating. After processing, the specimen is transferred from the cryo preparation chamber onto a highly stable SEM cold stage for observation. Cold trapping in the cryo preparation chamber and SEM chamber ensures the whole process is frost-free.

Features

• High resolution performance on SEM, FE-SEM and FIB/SEMs
• Totally gas cooled, including cryo preparation chamber – no boiling nitrogen on the SEM
• Efficient cooling (down to at least -190ºC)
• 24 hours plus run times on one fill of LN2 are typical – allowing unattended overnight operation (at typical operating temperatures)
• Large recipe driven touch-screen interface
• Automated sublimation, coating and system start up
• Superb specimen visibility
• Fully compatible with SEM beam deceleration/stage bias modes up to 5kV
• Off column cooling and pumping systems – minimum mass on the SEM
• On-screen data logging and diagnostics
• Pumped storage of the cryo transfer device
• Prepdek workstation – self contained work area, extra bench space not required
• Cryo workflow options
• Specialist support and extended warranty option

A dedicated, automated, timesaving and user-friendly system that enable TEM/STEM and SEM sample preparation for both cross section and plan view in a wide range of application. Featuring a cryo-cooled, dry sawing process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible TEM mount that allows rework.

Highlights

• Applicable for site-specific and general area
• Enables multiple reworks of TEM specimen
• Interfaces with broad and focused ion milling
• Increases overall throughput
• Improves yield analysis
• Improves characterization
• Low cost of ownership

Xact200 performs cutting-edge TEM/STEM sample preparation in line with the Semiconductor and Nanotechnology roadmap requirements for next generation physical FA and characterization.

The Xact200 is a second-generation system uniquely combines the disruptive innovative AIM technology with an integrated FE SEM column, in process real time STEM imaging capability and piezo based multi axes eucentric manipulator.

The Xact200 delivers excellent sample quality, significantly reduced turn-around times and enhanced productivity.

AIM, SELA’s proprietary Adaptive Ion Milling technology, is superior to traditional Focused Ion Beam (FIB) and Broad Ion Bean (BIB) technologies in ability to reduce lamella thickness below 15 nanometers over a large area with artifact-free quality, high precision, controlled thickness variation and high throughput.

Features

• Side and Plan view TEM/STEM preparation
• Top and back side Delayering
• SEM cross-section preparation for wide and high structures
• SCM and SSRM preparation
• Preparation of extremely big and extremely small objects
• TSV and bumps SEM and TEM/STEM preparation
• Real time STEM imaging during the milling
• Real time thickness measurement during the milling
• Ease of use

Highlights

• Unsurpassed quality with negligible artifacts
• Amorphous layer about 1nm on Si
• Routine lamella thinning to below 20nm covering a wide area of interest
• Thinning down to 10nm supporting 1x technology node
• Enhanced lamella thickness uniformity and robustness
• High precision milling with integrated FE SEM/STEM observation
• AIM technology enabled by unique ion milling unit With dynamic Xe ion beam

Perfect Cleave Mechanism (PCM) is a simple manual cleaving tool for cross-section of crystalline materials such as Si, GaN, GaAs, InPh, SiC and others.

PCM utilizes SELA’s proprietary Perfect Cleaving technologies to achieve fast cleaving of crystalline materials with perfect quality of cross-section.

The PCM had been presented to semiconductor market and delivered to customers in 2000 as a stand-alone solution for the sample preparation for SEM analysis and as a complementary tool for the initial sample preparation for the automatic nano cleaving series of SELA – MC500, MC600 and MC600i systems SELA’s customers recognized great capability of the PCM and utilized it for wide variety of preparation requirements for past 15 years.

PCM is a compact tool and customers use it under magnified glasses and optical stereo microscopes to improve accuracy of cleaving.

Features

• Perfect quality of cross-section for crystalline materials
• Fast cleaving in less than a minute
• Size of cleaved samples from full wafer and to single die 2x2mm
• Manually controlled accuracy
• Ease of use – – no previous experience required

Highlights

• Perfect quality of cross-section
• High throughput
• Improves and enhances SEM imaging
• Compact size
• Low cost of ownership

The SELA MC10 smart micro cleaving system is the advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput.

The MC10 utilizes and delivers to customers enhanced capabilities of wining SELA’s Micro Cleaving technology.

The MC10 smart table top system achieves semi-automatic, reliable, repeatable and rapid cross-sectioning of wafer segments and dies with high cleaving accuracy. Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis.

The set of the MC10 together with PCM and TMO features target marking, extraction of the initial sample and final cross-sectioning with high throughput, high consistent accuracy and the excellent natural lattice quality of the cross-sections produced.

Such advanced capabilities of the set of the MC10 significantly reduce the turnaround time for failure analysis and process monitoring.

Features

• Semi-automatic controllable cleaving process
• Accuracy better than 5 microns, mostly 2-3 microns
• Process time – single minute
• Extremally small input sample or die – down to 1×1 mm
• Cleaving as close as 1 mm to the wafer or die edge
• Continuous cleaving of multiple targets
• Advanced optics with variable magnification up to 1000x
• Software controllable cleaving process
• Built-in vacuum
• “Maintenance free” servicing model

Highlights

• Turnaround time significantly reduced
• Improves yield analysis
• Improves characterization
• Improves and enhances SEM and FIN utilization
• Low cost of ownership

The SELA newest MC10i smart micro cleaving system with capability of liquid nitrogen spraying is the advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput.

The MC10i utilizes and delivers to customers enhanced capabilities of wining SELA’s Micro Cleaving technology.

The MC10i smart table top system is the enhanced version of the MC10 platform equipped with liquid nitrogen spraying capability, achieves semi-automatic, reliable, repeatable and rapid cross-sectioning of wafer segments and dies with high cleaving accuracy.

Liquid nitrogen spraying during the cleaving provides strong additional capability for the failure analysis by drastically improving quality of the cross-section of metal lines, hard resist layers, TSVs and other materials.
Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis.

The set of the MC10i together with PCM and TMO features target marking, extraction of the initial sample and final cross-sectioning with high throughput, high consistent accuracy and the excellent natural lattice quality of the cross-sections produced.

Such advanced capabilities of the set of the MC10i significantly reduce the turnaround time for failure analysis and process monitoring.

Features

• Semi-automatic controllable cleaving process
• Accuracy better than 5 microns, mostly 2-3 microns
• Process time – single minute
• Extremally small input sample or die – down to 1×1 mm
• Cleaving as close as 1 mm to the wafer or die edge
• Continuous cleaving of multiple targets
• Advanced optics with variable magnification up to 1000x
• Software controllable cleaving process
• Built-in vacuum
• “Maintenance free” servicing model

Highlights

• Controllable liquid nitrogen spraying during cleaving
• High quality cross-sectioning of metals, resist and other materials
• Prevention of pull out of materials during the cleaving
• Turnaround time significantly reduced
• Improves yield analysis
• Improves characterization
• Improves and enhances SEM and FIN utilization
• Low cost of ownership

The SELA MC20 smart micro cleaving system with capability to register and cleave buried defects is the advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput.

The MC20 utilizes and delivers to customers enhanced capabilities of wining SELA’s Micro Cleaving technology together with the state-of-the-art optics.

The MC20 smart table top system, equipped with masterly designed comprehensive optical solution combined regular white and special IR optics, achieves semi-automatic, reliable, repeatable and rapid cross-sectioning of wafer segments and dies with high cleaving accuracy.

Observation from top and back sides of the sample provides strong additional capability for the failure analysis of buried defects. This capability answers to challenges in analysis of all kinds of failures in semiconductors, MEMS devices, dies extracted from package and others.

Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis.

The set of the MC20 together with PCM and TMO features target marking, extraction of the initial sample and final cross-sectioning with high throughput, high consistent accuracy and the excellent natural lattice quality of the cross-sections produced.

Such advanced capabilities of the set of the MC20 significantly reduce the turnaround time for failure analysis and process monitoring.

Features

• Accuracy better than 5 microns, mostly 2-3 microns
• Process time – single minute
• Small input sample or die – down to 4×2 mm
• Cleaving as close as 2 mm to the wafer or die edge
• Continuous cleaving of multiple targets
• Advanced optics with variable magnification up to 1000x
• Software controllable cleaving process
• Built-in vacuum
• “Maintenance free” servicing model

Highlights

• Semi-automatic controllable cleaving process for visible and buried defects
• Observation from top and bottom sides of the sample
• Registration and cross-section of buried defects
• Advanced white light and IR optics
• Turnaround time significantly reduced
• Improves yield analysis
• Improves characterization
• Improves and enhances SEM and FIN utilization
• Low cost of ownership

MC600i is a fifth generation version of the award-wining Nano Cleaving series of the sample preparation systems for cross-section of crystalline materials for following SEM inspection and other analyses.

The MC600i system utilizes Nano Cleaving and Micro Cleaving technologies in two main processes – full process and fast process.

SELA’s Nano Cleaving and Micro Cleaving technologies are proved themselves as undisputed leaders for accurate, fast and artifact-free sample preparation. The MC600i system achieves fully automatic, reliable and rapid cross sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, automatic off-loading for immediate inspection. High and consistent accuracy and excellent quality of cross-sections significantly reduce diagnostic cycle for failure analysis, characterization and process monitoring.

These features together with high throughput ensuring that sample preparation is never a bottleneck for SEM analysis.

Features

• Accuracy of full process is down to 100nm in 10 minutes
• Accuracy of fast cleave is down to 3 microns in 3 minutes
• Single die cleaving with dimensions down to 2x1mm
• Wafer and die edge cleaving down to 0.5mm from edge
• Controlled Liquid Nitrogen spraying to improve quality of cross section
• Ease of use – few hours training for new operator
• Automatic processing – no previous experience required

Highlights

• Turn-around time drastically reduced
• Improves yield analysis
• Improves characterization
• Improves and enhances SEM imaging
• High productivity
• Low cost of ownership

This recirculating filtration system allows up to 3-stage filtering down to 2 microns and is mounted in a durable cabinet that supports Allied grinding/polishing machines. The environmentally friendly filtration system saves up to 1/2 gallon of water per minute with quick-change stainless steel filters that are re-usable and cleanable. System includes cabinet/stand with a roll-out reservoir with 7-gallon (26.5 L) capacity and pull-out storage drawer. 

Features

• Cabinet mounted filtration system with quick-change filters
• Cabinet/Stand supports all Allied powerhead & manual grinding/polishing machines
• Configurable with up to 3 in-line filtration stages
• Accepts reusable stainless steel or disposable polymer filters (100-410XX series)
• Roll-out reservoir with 7-gallon (26.5 L) capacity
• Pull-out storage drawer
• 115/230V usage - wired for destination country voltage prior to shipment
• Environmentally friendly - saves up to 0.5 gallon (1.9 L) of water per minute
• Designed & manufactured by Allied in the USA
• Two (2) year warranty

The MetPrep3™/PH-3™ Glove Box grinder/polisher for hot/glove-box environments is a powerful system for semiautomatic operation, ideal for low to high volume sample preparation requirements. It is designed to withstand various glovebox environments (i.e., alpha-radiation inert) and has an overall reduced size to fit through most glove box portholes. Critical components of the machine have been removed to an external (remote) control box. Removable cover/side plates allow easy access for serviceability.

Intuitive menu navigation with a user-friendly touchpad interface and backlit LCD make them easy to use and program. The microprocessor-based system allows up to 25 programmable steps, including parameters for platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse, and force reduction (on/off, %)

Either aluminum or magnetic platens may be used with any plain/adhesive-backed or magnetic system disc.

MetPrep 3™ Features

• Touch-pad switches control all functions
• External control box protects critical components
• Removable side plates allow easy access for serviceability
• Reduced size fits through 14" diameter port-hole (some assembly required "in box")
• Programmable up to 25 polishing steps, including parameters for platen speed, comp/contrarotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse and force reduction (On/Off, %)
• Quick-change platen design, anodized to resist wear and corrosion
• Variable platen speed: 40-600 RPM (10 RPM increments)
• Clockwise/counterclockwise platen rotation
• 0.25 HP (190 W) motor with durable reduction gearbox for constant high-torque output
• Variable platen jog speed: 40-600 RPM (10 RPM increments)
• Stable aluminum/stainless steel construction
• Variable cycle time: 0-120 minutes (15 second increments)
• Emergency shut-off switch
• Corrosion/impact resistant cover
• Dimensions: 13" W x 19.5" D x 22" H (300 x 495 x 559 mm)
• Weight: 120 lb. (54 kg)

PH-3™ Power Head Features

• Unique tilt-up feature allows easy access to platen and holder
• Soft-start and force reduction control
• Simple push/pull attachment and removal of holders
• Quick-lock system allows sample holder positioning across entire platen surface
• Variable rotation speed: 0-150 RPM (10 RPM increments)
• 0.125 HP (95 W) motor with durable reduction gearbox for constant high-torque output
• Comp and contra rotation
• Central force sample preparation of up to 6 samples, adjustable from 5-50 lb. in 1 lb. increments (22-219 N in ~5 N increments)
• Individual force sample preparation of up to 3 mounts, adjustable from 0-16 lb. in 1 lb. increments (0-70 N in ~5 N increments)
• Six (6) month warranty
• Designed & manufactured by Allied in the USA
• Special Lead Time: 12 - 16 weeks

The Cross-Sectioning Tool is used to cross-section small, unencapsulated samples such as IC's and other electronic devices.

The handheld tool's unique design is stable, well-balanced and has a low center of gravity to avoid rocking during polishing. Adjustable Teflon™ feet are used to align the sample with the desired polishing plane. The cross-sectioning paddle is attached using a cam-locking system (no tools needed), allowing quick, easy paddle removal for sample inspection and exact repositioning throughout the polishing procedure.

Cross-Sectioning Tool Kit includes:

• #69-50000-1 Cross-Sectioning Tool Body with Cam-Locking System
• #15-1010 Cross-Sectioning Paddle with 3.1mm Removable SEM Adapter Pin
• #69-30010 Teflon™ Feet, (Pk/2) 
• #69-50020 Hex Wrench, 3/32"
• #71-10040 Hot Mounting Wax, Clear 50 Gram Stick
• #71-10000 EpoxyBond 110™ 2-Part Adhesive, ½ oz. Kit
• #72-20000 Glass Cover Slips, 18 mm sq., #2, (Pk/160)
• #50-05518 Rubber Squeegee, 2" x 3"
• #148-10000 Micro Organic Cleansing Soap (2 oz. sample)
• Storage Case

Features

• Lightweight anodized aluminum body for corrosion resistance
• Low profile fixtures fit under objectives in most microscopes
• Cam-Lock lever can be mounted on the right or left side according to operator's preference
• Aluminum cross-sectioning paddle fits into most SEMs without the need to demount the sample

The TEM Wedge Tool is used to thin materials to electron transparency for TEM observation. The rear micrometer heads allow radial or axial (wedge) angle adjustments in the sample. Non-rotating micrometer heads are available to eliminate faceting of Delrin® feet.

The cross-sectioning and Pyrex paddles attach using a cam-locking system (no tools needed), allowing quick, easy removal for sample inspection and exact repositioning throughout the polishing procedure. The small Pyrex footprint reduces planarization time due to less surface area making contact with the abrasive.

TEM Wedge Tool Kit includes:

• #15-1010 Cross-Sectioning Paddle w/3.1mm Removable SEM Adapter Pin
• #15-1013 TEM/FIB Thinning Paddle w/Pyrex® Insert (x 2)
• #15-1017 Heating/Mounting Stage
• #69-40037 Delrin® Feet for #15-2218 Micrometer Head (Pk/3)
• #71-10040 Hot Mounting Wax, Clear 50 Gram Stick
• #71-40045 Loc-Tite 460T Sample Bonding Glue, 20 Gram Bottle
• #69-40050 Glass Leveling Slides (Pk/5)
• #71-10000 EpoxyBond 110 2-Part Adhesive, ½ oz. Kit
• Storage Case

Features

• Lightweight anodized aluminum body for corrosion resistance
• Low profile fixtures fit under objectives in most microscopes
• Cam-Lock lever can be mounted on the right or left side according to operator's preference
• Aluminum cross-sectioning paddle fits into most SEMs without the need to demount the sample

The TwinPrep 5x™ grinding/polishing machine is designed for manual sample preparation. The powerful, quiet motor drives both platens simultaneously and provides constant high-torque output throughout the speed range, in either 10-500 or 20-1,000 RPM configurations. The 7" color LCD touchscreen with keypad entry is used to control all functions, with an intuitive interface optimized for efficiency. Five (5) user-defined presets allow quick and easy RPM selections, in either clockwise or counterclockwise rotation.  

Durable: Engineered and constructed using precision machined, hard-anodized aluminum, and stainless steel components to provide maximum longevity.

Easy to use: Straightforward controls and user-friendly functions for quick, repeatable operation.

Either standard or magnetic 8"/203 mm or 10"/254 mm platens may be used with any plain/adhesive backed or magnetic system disc.

Features

• Variable platen speed: either 10-500 RPM or 20-1,000 RPM (10 RPM increments) with five (5) adjustable presets
• 7" color LCD touchscreen with keypad entry to control all functions
• Powerful, quiet 0.6 HP (470 W) Brushless DC motor that provides constant high-torque output throughout the speed range Intuitive interface optimized for productivity and function
• Single motor drives both platens simultaneously
• Clockwise/counterclockwise platen rotation
• Sturdy RIM, aluminum and stainless steel construction
• Molded one-piece corrosion and impact resistant enclosure
• Overflow diversion to protect internal components
• Quick-change platen design, anodized to resist wear and corrosion
• Electronic coolant control with adjustable flow control valves
• Retractable coolant nozzles that allow quick and easy sample/bowl cleaning
• Low profile, tabletop design
• Dimensions: 31" W x 26" D x 9.5" H (780 x 660 x 240 mm)
• Weight: 136 lb. (62 kg)
• Two (2) year warranty
• Designed & manufactured by Allied in the USA
• CE Compliant for EU

The M-Prep 6x™ grinding/polishing machine is designed for manual sample preparation. The powerful, quiet motor provides constant high-torque output throughout the speed range, in either 10-500 or 20-1,000 RPM configurations. Touchpad controls activate coolant flow (adjustable) and start/stop. A 7" color LCD touchscreen with keypad entry is used to control all functions with an intuitive interface optimized for efficiency. Five (5) user-defined preset buttons allow quick and easy RPM selections in either clockwise or counterclockwise rotation.

Durable: Engineered and constructed using precision machined, hard-anodized aluminum and stainless steel components to provide maximum longevity.

Easy to use: Straightforward controls and user-friendly functions for quick, repeatable operation.

Either standard or magnetic 10"/254 mm or 12"/305 mm platens may be used with any plain/adhesive backed or magnetic system disc.

Features

• Variable speed with digital display: either 10-500 or 20-990 RPM (10 RPM increments) depending on model
• 7" color LCD touchscreen with keypad entry controls all functions
• Powerful 0.5 HP (375 W) DC motor provides constant high torque output
• Sturdy aluminum and stainless steel construction
• Quick-change platen design, anodized to resist wear and corrosion
• Corrosion/impact resistant cover
• Retractable coolant nozzle allows quick and easy bowl cleaning
• Electronic coolant control with adjustable flow control valve
• Low profile, table-top design
• Overflow diversion to protect internal components
• Dimensions: 22" W x 27" D x 10.5" H (560 x 690 x 267 mm)
• Two (2) year warranty
• Weight: 101 lb. (45 kg)
• CE Compliant for EU
• Designed & manufactured by Allied in the USA

The M-Prep 5x™ grinding/polishing machine is designed for manual sample preparation. The powerful, quiet motor provides constant high-torque output throughout the speed range, in either 10-500 or 20-1,000 RPM configurations. The 7" color LCD touchscreen with keypad entry is used to control all functions with an intuitive interface optimized for efficiency. Five (5) user-defined preset buttons allow quick and easy RPM selections in either clockwise or counterclockwise rotation. 

Durable: Engineered and constructed using precision machined, hard-anodized aluminum and stainless steel components to provide maximum longevity.

Easy to use: Straightforward controls and user-friendly functions for quick, repeatable operation.

Either standard or magnetic 8"/203 mm or 10"/254 mm platens may be used with any plain/adhesive backed or magnetic system disc.

Features

• Variable platen speed: either 10-500 or 20-1000 RPM (in increments of 10 RPM) with five (5) adjustable preset buttons 7" color LCD touchscreen with keypad entry to control all functions
• Powerful, quiet 0.6 HP (470 W) Brushless DC motor provides constant high-torque output throughout the speed range Intuitive interface optimized for efficiency and function
• Quick-change platen design, anodized to resist wear and corrosion
• Sturdy RIM, aluminum and stainless steel construction
• Clockwise/counterclockwise platen rotation
• Molded one-piece corrosion and impact resistant cover
• Retractable coolant nozzle that allows quick and easy sample/bowl cleaning
• Electronic coolant control with adjustable flow control valve
• Low profile tabletop design
• Overflow diversion to protect internal components
• Dimensions: 15" W x 28" D x 9" H (381 x 711 x 229 mm)
• Two (2) year warranty
• Weight: 58 lb. (26 kg)
• CE Compliant for EU
• Designed & manufactured by Allied in the USA

The MetPrep 1x™ precision grinding/polishing machine is excellent for manual preparation for standard applications, or when polishing delicate samples using handheld tools with lapping films that require extremely low RPM and consistent low-end torque. The 7" color LCD touchscreen with keypad entry is used to control all functions with an intuitive interface optimized for efficiency. Five (5) user-defined preset buttons allow quick and easy RPM selections from 5-350 RPM in either clockwise or counterclockwise rotation. The timer function allows either count-up or countdown operation.

Durable: Engineered and constructed using precision- machined hard-anodized aluminum and stainless steel components to provide maximum longevity.

Easy to use: Straightforward controls and user-friendly functions for quick, repeatable operation.

Either precision, standard or magnetic 8"/203 mm or 10"/254 mm platens may be used with any plain/adhesive backed or magnetic system disc.

Features

• Variable platen speed 5-350 RPM (5 RPM increments) with five (5) adjustable preset buttons
• 7" color LCD touchscreen with keypad entry to control all functions
• Powerful, quiet 0.7 HP (535 W) Brushless DC motor provides constant high-torque output throughout the speed range Intuitive interface optimized for efficiency and function
• Clockwise/counterclockwise platen rotation
• Timer for count-up or countdown operation
• Quick-change platen design, anodized to resist wear and corrosion
• Sturdy RIM, aluminum and stainless steel construction
• Retractable coolant nozzle that allows quick and easy sample/bowl cleaning
• Molded one-piece corrosion and impact resistant enclosure
• Low profile, tabletop design
• Electronic coolant control with adjustable flow control valve
• Dimensions: 15" W x 26" D x 9" H (381 x 660 x 230 mm)
• Overflow diversion to protect internal components
• Weight: 66 lb. (30 kg)
• Two (2) year warranty
• Designed & manufactured by Allied in the USA
• CE Compliant for EU

The AD-5™ fluid dispenser provides automatic, unattended application of abrasive polishing suspensions and lubricants. Its functions are controlled through Allied’s MetPrep 3™, MetPrep 4™, DualPrep 3™ or MultiPrep™ systems, and can also be used with ANY brand polishing machine as a standalone system.

Timed, volume-controlled, variable frequency dispensing delivers reproducible results by eliminating inconsistencies between operators. This increases productivity and efficiency, while reducing consumables usage. Intuitive menu navigation and simple logic programming make the dispenser easy to use.

The AD-5™ features five (5) dispensing positions, two of which include a flush cycle to prevent clogging when using colloidal suspensions. Peristaltic pump technology offers mist-free drip delivery to the polishing surface.

Features

• Five (5) dispensing positions, 16 oz. (500 mL) capacity; 128 oz (3.8 L) adapter kit available
• User-defined menu labeling (abrasive type & size, lubricant, cloth, material, and menu name)
• Remote function enabling seamless integration and automatic activation with Allied’s grinding and polishing systems Pump reverse after cycle to prevent dripping/contamination
• Local function to allow standalone operation with any grinder/polisher
• Pulse duration: 0.5 - 6.0 seconds (0.5 second increments)
• Pulse frequency: 1-10 per minute
• One-touch priming function for quick, initial charging of new cloths
• In-cycle priming that allows temporary "full-rate" dispensing onto polishing surface
• One-touch activation independent of menu for simple operation
• Pre-start charging of new/dry polishing cloths
• Allows dispensing of colloidal suspensions (silica, silica/alumina and alumina) with rinse/flush function to avoid clogging
• Two (2) positions with high-speed pumps for oxide polishing
• Peristaltic pumps offer mist-free drip dispensing
• Touchpad switches control all functions
• 25 programmable menus
• Optional password protection of menus
• Backlit 4-line LCD
• Dimensions: 8" W x 25" D x 9" H (203 x 635 x 228 mm)
• CE compliant for EU
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The OptiPrep™ System is designed for production polishing of a wide variety of optical components including Ferrules, Connectors, Waveguides, Silicon V-groove, Optical Chips, Capillary/Glass Lenses, Fiber Bundles, Ribbon Fiber and Bare Fiber

Optical polishing applications rely on specific geometry. The OptiPrep™ features a fixed cam-lock interface reference that is parallel to the plane of the platen. Desired sample angles are obtained based on geometric orientation built into the fixture.

Z-positioning/indexing is displayed on the digital indicator with 1-micron resolution and can be pre-set for unattended operation. Variable speed rotation/limit rotation and oscillation with variable sweep maximize use of the entire abrasive surface.

Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Applications where the OptiPrep™ is used often require custom fixtures. Please contact Allied for assistance with a current fixture or to design and manufacture a fixture for a complete solution.

Grinder/Polisher Features

• Variable platen speed: 5-350 RPM, in 5 RPM increments
• 7" LCD touchscreen with keypad entry to control all functions
• ¼ HP (190 W) DC motor with durable reduction gearbox provides constant high-torque output
• Digital timer and tachometer
• Integrated controls for operation of the OptiPrep™ Positioning Device
• Clockwise/counterclockwise platen rotation
• Quick-change platen design, anodized to resist wear and corrosion
• Corrosion/impact resistant cover
• Bowl flush to prevent debris build-up
• Electronic coolant control with adjustable valve

OptiPrep Positioning Device Features

• Front digital indicator displays real-time material removal/sample advancement
• Rear digital indicator displays vertical positioning (static) with zeroing function, 1 micron resolution
• Precision spindle design indexes sample perpendicular to the platen, and can rotate simultaneously
• Automatic sample oscillation, adjustable sweep with 6 speeds
• Full or limited automatic sample rotation with 8 speeds
• Cam-locking system eliminates the need for tools and allows for exact repositioning of fixtures
• Dimensions: 15" W x 26" D x 20" H (381 x 660 x 508 mm)
• Weight: 95 lb. (43 kg)
• Shipping Dimensions: 33" W x 31" D x 15" H (838 x 787 x 381 mm)
• Shipping Weight: 125 lb. (57 kg)
• Two (2) year warranty
• CE Compliant
• Designed & manufactured by Allied in the USA

The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing, or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. The 12" MultiPrep™ System has a scaled positioning device and higher torque rotation/oscillation motors for preparation of larger or multiple samples exceeding an area of 1,600 mm².

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

MultiPrep Positioning Head Features

• Front digital indicator to display real-time material removal (sample advancement), 1 µm resolution
• Precision spindle that indexes the sample perpendicular to the platen, and can rotate simultaneously
• Dual axis, micrometer controlled angular positioning of the sample (pitch and roll): +10°/-2.5° range (0.02° increments)
• Rear digital indicator to display vertical positioning (static) with zeroing function, 1 µm resolution
• Full or limited automatic sample rotation with 8 speeds
• Cam-locking system that eliminates the need for tools and allows for precise repositioning of fixtures
• Variable sample load: 0-600 g (100 g increments)
• Designed & manufactured by Allied in the USA

Grinder/Polisher Features

• Variable platen speed: 5-350 RPM (5 RPM increments)
• Digital timer and tachometer
• 7" color LCD touchscreen with keypad entry to control all functions
• Clockwise/counterclockwise platen rotation
• Seamless integration with optional AD-5™ Fluid Dispenser for automatic operation
• Electronic coolant control with adjustable valve
• Powerful, quiet 0.7 HP (535 W) Brushless DC motor that provides constant high torque output throughout the speed range Stable RIM, aluminum and stainless steel construction
• Molded one-piece corrosion and impact resistant cover
• Overflow diversion protects internal components
• Designed & manufactured by Allied in the USA
• CE Compliant for EU
• Two (2) year warranty

The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. 

Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. 

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize the use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

MultiPrep Positioning Head Features

• Front digital indicator to display real-time material removal (sample advancement), 1 µm resolution
• Precision spindle that indexes the sample perpendicular to the platen, and can rotate simultaneously
• Dual axis, micrometer controlled angular positioning of the sample (pitch and roll): +10°/-2.5° range (0.02° increments)
• Rear digital indicator to display vertical positioning (static) with zeroing function, 1 µm resolution
• Full or limited automatic sample rotation with 8 speeds
• Cam-locking system that eliminates the need for tools and allows for precise repositioning of fixtures
• Variable sample load: 0-600 g (100 g increments)
• Designed & manufactured by Allied in the USA

Grinder/Polisher Features

• Variable platen speed: 5-350 RPM (5 RPM increments)
• Digital timer and tachometer
• 7" color LCD touchscreen with keypad entry to control all functions
• Clockwise/counterclockwise platen rotation
• Seamless integration with optional AD-5™ Fluid Dispenser for automatic operation
• Electronic coolant control with adjustable valve
• Powerful, quiet 0.7 HP (535 W) Brushless DC motor that provides constant high torque output throughout the speed range Stable RIM, aluminum and stainless steel construction
• Molded one-piece corrosion and impact resistant cover
• Overflow diversion protects internal components
• Designed & manufactured by Allied in the USA
• CE Compliant for EU
• Two (2) year warranty

The NEW CF-1™ central force loading station uses pneumatics to apply uniform downforce to align the mounts on the same plane in the sample holder, resulting in reduced grinding time. The rotating base provides convenient movement of the sample holder and equally sets the mount height for proper spacing. The pivot arm features a graduated scale for repeatable positioning which is adjustable using the two (2) large red knobs that are knurled for improved grip.

The unit requires compressed air like that provided to the power head. This is used to both secure the sample holder firmly in place and provide force to the pad to firmly secure the mount when tightening the sample holder screw(s).

The base system is supplied with a single applicator pad and unloading plate. The dual applicator accessory is sold separately and recommended for use with either dual-cavity or large cavity sample holders.

Features

• Pneumatic loading ensures mount/sample planarity
• Reduces initial planarizing/grinding process time and consumable usage
• Rotating base supports rapid loading and unloading of mounts
• Graduated scale on pivot arm simplifies loading setup
• Ambidextrous (right or left-hand) use
• Compatible with all Allied Central Force sample holders
• Two (2) year Warranty
• Designed & manufactured by Allied in the USA

Allied's NEW high-volume Printed Circuit Board (PCB) microsectioning and analysis solution makes it easy to prepare and document high-volume microsections for compliance with IPC standards.

From pin insertion and mounting to grinding/polishing to an automated measurement and archiving system, Allied provides a complete solution.

Features

• High-volume preparation of up to fifty-four (54) multi-layer coupons
• For coupons with a 2 mm or 0.094" Ø hole (uses 50 mm L pin)
• Complies with IPC TM-650, No. 2.1.1, Rev. F, Method B
• Universal design adapts to non-Allied Machines with Drive Adapter
• Includes Pin Insertion Press for PCB/Coupon Preparation System
• Includes PCB Sample Holder with Adjustable Carbide Stops, 6-position
• Includes Carbide Stop Height Gauge Assembly for setting carbide stop height of PCB Sample Holder
• Use with MetPrep 4™ PCB Grinder/Polisher with PH-4c™ Power Head

The DualPrep™ Grinding/Polishing machines grinding and polishing machines, with the PH™ line of power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. A wide variety of combinations provides ideal solutions that accommodate any lab, application, or material.

Intuitive menu navigation with a user-friendly touchpad interface and backlit LCD make them easy to use and program. The microprocessor-based system allows up to 25 programmable steps, including parameters for platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse, and force reduction (on/off, %).

The PH-3™/PH-4™ power heads offer maximum versatility for low to high volume semi-automatic sample preparation, using either central or individual sample force modes. The pneumatic-electric system provides controlled sample force and allows up to 12 samples to be prepared simultaneously, depending on power head, mount diameter, and holder size. The unique tilt-up design allows easy, unhindered access to the sample holder and platen, and eliminates the need to reposition the head during the preparation procedure.

Either standard or magnetic platens may be used with any plain/adhesive backed or magnetic system disc.

Features

• Programmable up to 25 grinding/polishing steps, including parameters for force mode, platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse and force reduction (on/off, %)
• Sturdy RIM, aluminum and stainless steel construction with low-profile design
• Variable cycle time: 0-120 minutes (15 second increments)
• Molded one-piece corrosion resistant cover
• Powerful 0.5 HP (375 W) motor with constant high torque output
• Quick-change platen design, anodized to resist wear and corrosion
• Electronic coolant control with adjustable flow control valve
• Touchpad switches control all functions
• Adjustable, pivoting coolant nozzle allows quick and easy sample/bowl cleaning
• Variable platen and jog speed: 40-600 RPM (10 RPM increments)
• Seamless integration with optional AD-5™ Fluid Dispenser for automatic operation
• Overflow diversion to protect internal components
• CE compliant for EU
• Emergency shut-off switch
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The E-Prep 4™ grinding and polishing machine, with the PH-4i™ power head, is a simple yet powerful system for semiautomatic operation, ideal for low to high volume sample preparation requirements. The user-friendly manual and touchpad interface makes it easy to adjust settings and operate. Basic controls allow quick changes to parameters such as sample force, cycle time, platen speed, and sample speed.

Either standard or magnetic 8”/203 mm or 10”/254 mm platens may be used with any plain/adhesive backed or magnetic system disc.

Standard/magnetic platens and sample holders are sold separately.

Features

• Selectable platen speeds: 150, 300 and 600 RPM
• Sturdy RIM, aluminum and stainless steel construction with low profile design
• Variable cycle time: 30, 60, 90 seconds; 2-9 minutes (1 minute increments)
• Molded one-piece corrosion and impact resistant cover
• Powerful 0.5 HP (375 W) high torque DC motor
• Quick-change platen design, anodized to resist wear and corrosion
• Electronic coolant control with adjustable flow control valve
• Manual and touchpad switches control all functions
• Adjustable, pivoting coolant nozzle allows quick and easy sample/bowl cleaning
• Overflow diversion to protect internal components
• Emergency shut-off switch
• Emergency shut-off switch
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The MetPrep 4™ grinding and polishing machines, with the PH™ line of power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. A wide variety of combinations provides ideal solutions that accommodate any lab, application, or material.

Intuitive menu navigation with a user-friendly touchpad interface and backlit LCD make them easy to use and program. The microprocessor based system allows up to 25 programmable steps, including parameters for platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse, and force reduction (on/off, %).

The PH-4™/PH-6™ power heads offer maximum versatility for low to high volume semi-automatic sample preparation, using either central or individual sample force modes. The pneumatic-electric system provides controlled sample force and allows up to 12 samples to be prepared simultaneously, depending on power head, mount diameter, and holder size. The unique tilt-up design allows easy, unhindered access to the sample holder and platen, and eliminates the need to reposition the head during the preparation procedure.

Either standard or magnetic platens may be used with any plain/adhesive-backed or magnetic system disc.

Features

• Programmable up to 25 grinding/polishing steps, including parameters for force mode, platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse and force reduction (on/off, %)
• Sturdy RIM, aluminum and stainless steel construction with low-profile design
• Variable cycle time: 0-120 minutes (15 second increments)
• Molded one-piece corrosion resistant cover
• Powerful 1.5 HP (1100 W) motor with constant high torque output
• Quick-change platen design, anodized to resist wear and corrosion
• Electronic coolant control with adjustable flow control valve
• Touchpad switches control all functions
• Adjustable, pivoting coolant nozzle allows quick and easy sample/bowl cleaning
• Variable platen and jog speed: 50-400 RPM (10 RPM increments)
• Seamless integration with optional AD-5™ Fluid Dispenser for automatic operation
• Overflow diversion to protect internal components
• CE compliant for EU
• Emergency shut-off switch
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The MetPrep 3™ grinding and polishing machines, with the PH™ line of power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. A wide variety of combinations provides ideal solutions that accommodate any lab, application, or material.

Intuitive menu navigation with a user-friendly touchpad interface and backlit LCD make them easy to use and program. The microprocessor based system allows up to 25 programmable steps, including parameters for platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse, and force reduction (on/off, %).

The PH-3™/PH-4™ power heads offer maximum versatility for low to high volume semi-automatic sample preparation, using either central or individual sample force modes. The pneumatic-electric system provides controlled sample force and allows up to 12 samples to be prepared simultaneously, depending on power head, mount diameter, and holder size. The unique tilt-up design allows easy, unhindered access to the sample holder and platen, and eliminates the need to reposition the head during the preparation procedure.

Either standard or magnetic platens may be used with any plain/adhesive backed or magnetic system disc.

Features

• Programmable up to 25 grinding/polishing steps, including parameters for force mode, platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse and force reduction (on/off, %)
• Sturdy RIM, aluminum and stainless steel construction with low-profile design
• Variable cycle time: 0-120 minutes (15 second increments)
• Molded one-piece corrosion resistant cover
• Powerful 0.5 HP (375 W) motor with constant high torque output
• Quick-change platen design, anodized to resist wear and corrosion
• Electronic coolant control with adjustable flow control valve
• Touchpad switches control all functions
• Adjustable, pivoting coolant nozzle allows quick and easy sample/bowl cleaning
• Variable platen and jog speed: 40-600 RPM (10 RPM increments)
• Seamless integration with optional AD-5™ Fluid Dispenser for automatic operation
• Overflow diversion to protect internal components
• CE compliant for EU
• Emergency shut-off switch
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The use of pressure with acrylics and epoxies prevents the formation of small bubbles (outgassing) caused by elevated exothermic temperatures during hardening. This also produces clearer mounts with better edge retention, improved adhesion and reduced shrinkage. Maximum rating: 35 psi (2.4 bar)

Features

• Regulated, nominal operating pressure: 35 PSI (2.4 bar)
• Chamber Dimensions: 4.75" (120 mm) Diameter x 3.75" (95 mm) Depth
• One (1) year warranty
• Overall Dimensions (including bracket): 6.5" W (164 mm) x 6" (150 mm) Chamber Diameter x 8.5" H (214 mm)
• Weight: 8 lb. (3.6 kg)
• Designed & manufactured by Allied in the USA

The PC-200™ is a large volume pressure chamber for cold mounting with acrylic and epoxy. With an 8" opening and 7.5" depth, this pressure chamber accommodates oversized silicone mounting cups, a large quantity of round cups, or multiple PCB molds.

The process of loading the PC-200™ pressure chamber with freshly poured molds is made easier with the stacking tray. The diameter of the tray easily fits into the chamber opening. The bottom of the tray is Teflon® for easy cleanup of spilled mold resin (acrylic or epoxy). The design allows for stable stacking of three (3) trays into the PC-200.

Features

• Supply pressure, min/max: 43/145 PSI (3/10 bar) (hose not included)
• Inlet: ¼” ID or 6 mm depending on region (8 mm barb with 6 mm (ID) compression nut)
• Regulated, nominal operating pressure: 29 PSI (2 bar)
• Maximum operating pressure: 40 PSI (2.8 bar)
• Overall Dimensions: 12" H × 16" D × 12" H (300 × 400 × 300 mm)
• Inside height: 7.5" (190 mm)
• Weight: 19 lb. (8.6 kg)
• One (1) year warranty
• Designed & manufactured by Allied in the USA

The VacuPrep™ removes trapped air from uncured epoxy, filling open pores and cavities in samples to provide maximum bonding and support. This maintains sample integrity during abrasive preparation, reducing the chance of cracking or delamination.

The VacuPrep™ comes in two (2) versions - the standard model and a turntable model.  This new variant adds a turntable with an anti-stick PTFE lined interior that operates with a rotation wheel located on the exterior right side of the unit. The turntable features markings where cups can be positioned beneath the fill tube in the cover. The operator then rotates the wheel on the right side of the unit to position each cup for drawing epoxy from the mixing cup while under vacuum.

Features

• Through-port for optional epoxy fill under vacuum
• Cup holder for mixed epoxy
• Clear top allows sample viewing during process
• Pulls up to 28 inHg vacuum
• Large 10" x 4.5" (254 x 114 mm) deep chamber; holds up to (30) 1.25" (32 mm) cups
• Stainless steel components resist corrosive gases
• Quiet, pump-free operation
• Operates with compressed air, 80 psi (5.5 bar)
• Dimensions: 13" W x 18" D x 6" H (330 x 457 x 152 mm)
• Weight: 21 lb. (9.5 kg)
• Designed & manufactured by Allied in the USA
• Two (2) Year warranty

The Newly Updated TechPress x3™ electro-hydraulic automatic mounting press is used to encapsulate samples for metallographic preparation.

The microprocessor-based system features 2 modes of operation; "manual input" and "one-touch programs", which includes a pre-loaded database with 80 adjustable programs, including parameters for mold size, single mount, or duplexing, mounting resin, curing time and temperature, pressure, and cooling time. 

Temperature can be displayed in either Fahrenheit or Celsius and pressure can be displayed in either psi or BAR throughout the mounting procedure. The operator can choose to display instructions and menus on the 7" color LCD touchscreen in 10 common languages (English, Italian, French, Spanish, Portuguese, German, Russian, Korean, Chinese, and Japanese).

Two mounts can be produced at one time in 5 minutes using the duplexing spacer.

Mold assemblies that range from 25 mm to 2" can be changed and include a duplexing spacer, allowing up to two mounts per cycle to be produced at one time. 

Features

• Two modes of operation; “manual input” or one-touch “programs” from a database of 80 preloaded, adjustable parameters for mold size, single mount or duplexing, mounting resin, curing time and temperature, cooling time and pressure
• Mold assemblies that can be changed from 25 mm through 2", and include a duplexing spacer, allowing up to two mounts per cycle
• Prepare up to two mounts in 5 minutes
• 7" color LCD touchscreen with keypad entry to control all functions
• Selectable languages: English, Italian, French, Spanish, Portuguese, German, Russian, Korean, Chinese and Japanese Intuitive interface optimized for productivity and function
• Safety sensor to require full closure of bayonet cap before cycle start
• Selectable units: psi/BAR and °C /°F
• One-touch or momentary-touch ram extension and retraction
• Bayonet holding tray that protects the die from damage between cycles
• Non-conductive bayonet handles remain cool during operation
• Password protectable parameters
• Compact, narrow footprint
• Enclosure resistant to impact, corrosion, and heat
• Seamless integration with optional #5-1550 Recirculating Coolant System for stand-alone or "green" operation
• Curing Temperature: 0-200 °C (32-392 °F)
• Molding pressure: up to 4500 psi (310 Bar)
• Curing time: 0-100 minutes
• Heating power: 1500 W
• Dimensions: 11.5" W x 22" D x 19" H (292 x 559 x 483 mm)
• Cooling time: 0-100 minutes
• CE compliant for EU
• Weight: 85 lb. (38.5 kg)
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The TrimSaw 2x™ is a manual-feed, variable speed table saw that is ideal for cutting printed circuit boards, composite/ceramic substrates, electronic devices and other nonmetals. 

Cutting fluid is drawn from the reservoir by the rotating blade, applied to the sample during sectioning, then channeled back to the reservoir through holes in the platform. 

When using a 6-inch diameter blade, the rim extends 1.6” (41 mm) above the cutting platform, allowing up to 1.5” (38 mm) thick samples to be sectioned. The adjustable rip-fence is made of stainless steel and allows measured, guided sectioning through the blade. Optional miter-guide and multipurpose fixtures slide in the table slot for more precise cutting requirements or when handheld sectioning cannot be tolerated.

Features

• 3.5" color LCD touchscreen to control all functions
• 4-6" (100-150 mm) diameter blade range, 0.5" (12.7 mm) arbor hole
• Precision machined aluminum and SS construction for maximum durability
• 0.25 HP (190 W) motor, variable speed: 500-3,000 RPM (100 RPM increments) with four (4) adjustable presets
• Large cutting platform: 6.75" W x 12.5" D (171 x 318 mm) accomodates oversized samples
• Adjustable table rip fence for guided sectioning
• Coolant reservoir, 1 gallon (3.8 L) capacity
• Slotted table to accept fixtures for linear cutting
• Weight: 35 lb. (15.9 kg)
• Dimensions: 18" W x 20" D x 11" H (457 x 508 x 279 mm)
• Designed & manufactured by Allied in the USA
• Two (2) year warranty

The TechCut 4x™ is a precision low-speed saw excellent for cutting smaller, delicate samples that cannot tolerate increased heat caused by high-speed sectioning. A 3.5" color LCD touchscreen is used to control all functions with an intuitive interface optimized for efficiency. The pivoting cutting arm has adjustable weights to apply or counterbalance downward force to the sample during sectioning. Cutting fluid is drawn from the reservoir by the blade to cool the sample. With a 3" to 6" blade range, samples up to 2" thick can be sectioned.

Features

• Gravity-fed cutting system
• 3-6" (75-150 mm) diameter blade range, 0.5" (12.7 mm) arbor hole
• 3.5" color LCD touchscreen to control all functions
• Variable speed: 10–500 RPM (in increments of 10 RPM) with five (5) adjustable preset buttons
• Micrometer sample indexing, 0.002 mm resolution, 0-25 mm range
• Cutting capacity: 2" (51 mm) thickness
• Optical shut-off sensor with adjustable stop to control depth of cut
• Spring-retractable dressing stick attachment for dressing while sectioning
• 0.06 HP (45 W) motor with durable reduction gearbox for constant high-torque output
• Precision-machined aluminum and stainless steel construction that maximizes corrosion resistance and durability
• 2.5" (63 mm) distance between blade and center wall
• Sliding weights (with graduated arm indicators) provide variable sample loading: 0-300 grams
• Removable coolant reservoir
• Blade Flanges: 1.9" Diameter
• Removable splash shield
• Removable catch screens prevent sectioned pieces from falling into reservoir
• Dimensions: 13" W x 15" D x 13" H (330 x 381 x 330 mm)
• Weight: 36 lb. (16 kg)
• Two (2) year warranty
• CE compliant for EU
• Designed & manufactured by Allied in the USA

The TechCut 5x™ precision high-speed saw is a versatile, programmable machine designed to cut a wide variety and size of materials. It automatically sections materials at high speeds, increasing sample throughput. The PLC-based system controls sample feed rate, distance and force. Closed-loop monitoring of the blade and table optimizes cutting performance and minimizes blade breakage by automatically adjusting the feed rate when variations in sample material or thickness are detected. When sectioning is complete, the table automatically retracts the sample to the home position and stops blade rotation and coolant flow. The unique fixturing system allows for easy changes between the T-Slot Table and the X-Axis Tables. Both tables offer a variety of convenient table-specific fixture options.

Features

• Cutting capacity: up to 2.5" (63 mm) bar stock
• Motorized (joystick) Y-axis sample positioning
• Accepts 3-8" (76-203 mm) blades with either 0.5" (12.7 mm) or 1.25" (32 mm) arbor hole
• Manual (hand wheel) Y-axis sample positioning/cutting
• Programmable feed rate from 0.01" to 5" (0.2 mm to 125 mm) per minute
• Variable blade speed: 500-5000 RPM (100 RPM increments)
• Sample rotation for difficult, round or thick samples (with optional #5-5745 Rotational Cutting Attachment)
• Automatic Y-axis sample advancement with soft-start and closed loop positional feedback
• Selectable cutting force (low, medium, high) optimizes feed rate based on blade load
• Programmable cut depth up to 8”/200 mm (0.01”/.2 mm increments) with high-speed auto retraction
• Distance/Time Remaining function allows real-time monitoring until cycle completion
• Push-button spindle lock for easy blade changes
• Closed-loop load monitoring to reduce blade binding/breakage
• Selectable units of measure - imperial or metric
• Intuitive interface optimized for productivity and efficiency
• 1.25 HP (950 W) high torque DC motor
• 7" color LCD touchscreen with keypad entry to control all functions
• LED illuminated interior with external switch
• Adjustable Y-axis jog speeds with joystick proportional control
• Adjustable coolant flow and position with coolant wash-down hose
• Protective metal cover with viewing windows and safety auto shut-off sensor
• Water flow-through model available
• Stainless steel reservoir - either internal 1.25 gallon (4.7 L) or external 7 gallon (26.5 L) capacity
• Strongly recommend #5-5580 Magnetic Particle Collector if cutting ferrous metals
• CE compliant for EU
• Weight: 142 lb. (65 kg)
• Dimensions: 24" W x 25" D x 19" H (610 x 635 x 483 mm)
• Designed & manufactured by Allied in the USA
• Two (2) year warranty

The PowerCut 10x™ is a powerful, manual bench-top cut-off saw designed for low to high volume applications. It accommodates blades ranging from 8" to 10" in diameter, allowing a wide variety of sample shapes and sizes up to 3.75" (95 mm) thick to be sectioned. A side port allows the cutting of longer samples such as bar stock. The PowerCut 10x™ has been redesigned with updated features such as an external wash-down hose & nozzle; blade guard with improved coolant manifold; improved drain flow through a larger opening; torsion-style motor return spring; new LED lighting and a taller cover with improved edge profile to keep water/coolant from dripping out.

Features

• 10-inch (254 mm) diameter blade capacity
• Accepts blades with either 1.25" or 32 mm arbor hole
• Powerful 3.5 HP (2600 W) stainless steel waterproof motor, 3,450 RPM
• Cutting capacity: up to 3.75" (95 mm) bar stock
• 5" (127 mm) distance between blade and motor allowing longer/larger parts to be sectioned
• Optional 5-4005 Quick-Slide stainless steel vise with 3.45" (87 mm) capacity
• Two (2) T-slot tables allow front-to-back and side-to-side vise/clamp positioning
• Optional 5-4050 Vertical Adjusting Clamp available for odd-shaped samples
• Large shatterproof viewing window
• Sturdy cast aluminum base
• LED Illuminated interior
• Electronic brake to stop blade at end of operation
• Counterbalanced, corrosion-proof stainless steel motor with direct drive
• Emergency shut-off switch
• Corrosion and impact resistant cover
• CE compliant for EU
• Side port for cutting long samples
• Safety switch to stop blade when cover is lifted
• Dimensions: 32" W x 32" D x 27.5" H (813 x 813 x 699 mm)
• Weight: 168 lb. (76 kg)
• Two (2) year warranty
• Designed & manufactured by Allied in the USA

The X-Prep® Vision™ is a metrology tool that enables measurement of silicon and semitransparent substrates. It is necessary for applications that require uniform thinning to a specific target with a tolerance of +/- 3 µm or better.
The X-Prep® fixture adapter is also secured to the motorized stage on the X-Prep® Vision™, ensuring the measurement/tool control coordinates remain aligned when transferred between systems.

A library with over 130 materials (i.e., GaAs, InGaAs, SiC, Sapphire/Al2O3, InP, SiGe, GaN, photo-resist) is included with every system.

Meaurement & Observation – How it Works

IR light is focused onto a sample, and a unique signal based on the refractive index of the material is created. The return signal is analyzed by the software to produce a thickness value.

Measuring Below 10 µm Thickness

For applications requiring thinning to less than 10 µm, precise measurement is possible only by adding the visible light spectrometer accessory.

Features

• Multipoint scan or single-point thickness measurement
• 10 microns to full thickness (1 mm) range of measurement (15 nm to 1 mm thick)
• Motorized, automatic X/Y/Z (auto-focus) with <1s acquisition time
• Automatic edge and corner detection aligns measurement grid with X-Prep® - including theta correction
• Edge exclusion with X/Y input
• Stage fitted with X-Prep® fixture adapter
• "Drive to Coordinate" software navigation
• Viewing of either 2D plot/map or 3D graph
• Supplied with Allied proprietary X-Correct™ software
• CCD camera included
• Roughness - 15 micron finish
• 100 mm x 100 mm X/Y range of motion
• Software automation extendable through .NET
• Data export using standard Windows methods
• One (1) year warranty
• Dimensions: 14" W x 17" D x 19" H (355 x 431 x 483 mm)

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.
It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence. As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation. Help buttons on each screen provide access to additional explanation and instruction.

A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.

Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool. Unevenly mounted or tilted samples can easily be leveled using this functionality.

A variety of fixtures and accessories are available to accommodate various sample types and sizes.

Features

• Easy-to-use, wizard-based workflow guides the operator through system setup to define: X/Y/Z tool position; X/Y tool feed rate, pattern and overlap; Z-force; and Z-position - no G-coding or programming knowledge required
• Three (3) Z-control modes: Position (Milling/Grinding); Position Force (Grinding/Polishing); Floating Force (Polishing)
• Optional 3D Software Module adds functionality/capability that includes: automatic 3D mapping/profiling; convex & concave profile deprocessing; and Excel® profile visualization/profile manipulation macro
• Motorized leveling stage for: automatic parallel leveling of sample to the X/Y tool plane; sample leveling - dual-axis control with 0.5 micron resolution; definable "off-axis" tilt adjustment
• Granite rail support chassis for improved thermal and mechanical stability
• Live HD (720p) video navigation to define X/Y milling/grinding/polishing boundary
• Closed-loop Z-axis positioning, 0.1 micron resolution, 1 micron accuracy
• Closed-loop X/Y-axis positioning, 1 micron resolution
• 12" color LCD, touch-screen graphic user interface
• Closed-loop Z-axis force control, 0.5 to 10 N
• Universal tool collet uses 3 mm x 1.5" (38 mm) length tools (0.25 mm - 12 mm grinding/polishing tip)
• Up to 100 x 100 mm X/Y travel
• Weight: 210 lb. (95 kg) - Shipping weight: 310 lb. (141 kg)
• Dimensions: 21" W x 27" D x 25" H (533 x 686 x 622 mm)
• Designed & manufactured by Allied in the USA
• Two (2) year warranty