AX-LS Series Laser Scriber

Engineered to high standards, the Axis Tec AX-LS series of Laser Scribers improve yield by creating much narrower scribe lines than traditional mechanical scribing using  conventional blade dicers.

​The non contact scribing process works by carving a groove hole while melting/vaporizing the wafer surface layers away using a laser beam at a wavelength that causes the material to absorb it.

​The AX-LS series allows manufacturers to cleanly scribe brittle materials with its robust, user friendly platform, allowing for reliable manufacturing at a lower cost.

Applications

  • Silicon Wafer Scribing
  • Ceramic Panel Grooving/Cutting

Advantages

  • Robust & Reliable
  • Low Maintenance Cost
  • Minimal Downtime
  • High Process Repeatability

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