Ultimate Throughtput in Lift-Off Processes with 150mm or 200mm Wafers

The Temescal UEFC-5700 with Auratus represents our ultimate high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of forty-two 150mm wafers per load via high capacity e-beam evaporation.

The load locked product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. Dual-cryopumps make it possible to pump this large chamber in 10 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features

• Large capacity: 42 x 150mm
• 40% more wafers with no increase in footprint or power consumption
• Less than 10 minutes to 5E-07 Torr
• 44,000 L/sec pumping
• Significantly less surface area and volume

System

• Ultimate Uniformity Production: 150 & 200mm
• Product Chamber Type: conic
• Load Lock to isolate Product Chamber
• Cryopump water L/sec: 44,000
• Pump down time: 1E-06 < 10mins
• E-gun (max pkg): 2 6x25cc PopTops + 1 fixed pocket
• E-gun Power Supply: 6, 12, or 15 kW
• Ion gun: MKII HC
• Max wafer count: Lift off 42x150mm, 21x200mm
• Source to Substrate: std 43”

System Control

• Temescal Control System (TCS), with Auto, Manual modes plus process datalogging
• Security code-based access for multiple classes of users
• TCS-based process variable monitoring (PVM), allowing user to set tolerance alarms for critical process variables
• 17″ high resolution color touch screen interface

E-Beam

• Temescal 4- or 6-pocket Standard or PopTop turret source
• Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
• TemEBeam Contoller: Sweep, Index, Gun & HV

Substrate

• HULA: High Uniformity Lift-off Assembly
• Lift-off dome or dome frame with segments
• Flip tooling: allows for two sided or edge coating
• VAP: Variable Angle Planetary

Vacuum Pumping & Control

• Market leading dry roughing pump >60 cfm (102 m3/h)
• CTI On-Board Cryopumps
• Cryopump temperature monitoring
• Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS

Product Chamber

• Dimensions in inches: 57 conic
• Product chamber cryopump: Dual CT-400 35,000 L/Sec
• Water cooled product chamber walls
• Two sets of product chamber evaporation shields
• Wide-angle viewport on front of system
• Maskless uniformity
• Spare port(s) for RGA or alternate access
• 10” and 12.75” diameter side ports for optional components

Source Chamber

• Source-isolation valve allows product chamber access while source chamber remains under vacuum
• Source chamber cryopump: CT-10 (9,000 L/Sec)
• Source Tray Dimensions in inches: 25.5
• Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
• Wide-angle 4” viewport
• Removable stainless-steel source shields

Water & Air System

• Stainless steel manifold provides cooling water for source and product chamber components
• Separate product chamber circuit for cold and optional hot water
• TCS-controlled auto-blowdown for turret source
• PLC-controlled air manifold

System Wide

• 3 EMO switches
• Standard 19” wide electronics rack on casters
• Surfaces exposed to high vacuum are made of 304 SST