Temescal FC-4400 Deposition System

Load Locked and Optimized for Lift-Off Processes

The Temescal FC-4400 represents our ultimate classic-configuration, high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of thirty 150mm wafers per load via high capacity e-beam evaporation.

The load locked, 44 inch x 44 inch x 28 inch product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. The dual-cryopump option makes it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features

  • Product chamber dimensions: 23.5″ high x 44″ x 44″
  • 25.5″ diameter source tray
  • Standard source-to-substrate distance: 38″
  • S-S distance with optional source well extension collar: 42″
  • Optional second product and source chamber cryopumps


  • Production: 150 & 200mm
  • Product Chamber Type: box
  • Load Lock to isolate Product Chamber
  • Cryopump water L/sec: 44,000
  • Pump down time: 1E-06 < 10mins
  • E-gun (max pkg): 2 6x25cc PopTops + 1 fixed pocket
  • E-gun Power Supply: 6, 12, or 15 kW
  • Ion gun: MKII HC
  • Max wafer count: Lift off 30x150mm,15x200MM
  • Source to Substrate: std 38″
  • Source to Substrate: ext 42″

System Control

  • Temescal Control System (TCS), providing auto, manual, and service modes plus process datalogging
  • Security code-based access for multiple classes of users
  • TCS-based process variable monitoring (PVM) allows user to set process tolerance alarms for critical process variables
  • 17″ high resolution color touch screen interface


  • Temescal 4- or 6-pocket Standard or PopTop turret source
  • Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
  • TemEBeam Contoller: Sweep, Index, Gun & HV


  • HULA: High Uniformity Lift-off Assembly
  • Lift-off dome or dome frame with segments
  • Flip tooling: allows for two sided or edge coating
  • VAP: Variable Angle Planetary

Vacuum Pumping and Control

  • Market leading dry roughing pump >60 cfm (102 m3/h)
  • CTI On-Board Cryopumps
  • Cryopump temperature monitoring
  • Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS

Product Chamber

  • Dimensions in inches: 23.52x44H
  • Product chamber cryopump: Dual CT-400, 35,000 L/Sec
  • Water cooled product chamber walls
  • Two sets of product chamber evaporation shields
  • Wide-angle viewport on front of system
  • One fixed uniformity mask
  • Spare port(s) for RGA or alternate access
  • Left-side door for service access

Source Chamber

  • Source-isolation valve allows product chamber access while source chamber remains under vacuum
  • Source chamber cryopump: CT-10 9,000 L/Sec
  • Source Tray Dimensions in inches 25.5
  • Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
  • Wide-angle 4” viewport
  • Removable stainless-steel source shields

Water & Air System

  • Stainless steel manifold provides cooling water for source and product chamber components
  • Separate product chamber circuit for cold and optional hot water
  • TCS-controlled auto-blowdown for turret source
  • PLC-controlled air manifold

System Wide

  • 3 EMO switches
  • Standard 19” wide electronics rack on casters
  • Surfaces exposed to high vacuum are made of 304 SST

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