Temescal FC-3800 Deposition System

Ideal for Production Lift-Off, Step-Coverage, and Dual-Sided Coating Applications

The Temscal FC-3800 enables rapid processing of 150mm diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 150mm diameter wafers for lift off or thirty-six 150mm wafers for step coverage. The 38″ x 38″ x 28″ product chamber is pumped by a high throughput 16″ cryopump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10″ cryopump.

Convenient Maintenance

The offset pumping port, the hinged door panels, and the swingout source tray are high-value maintenance features in Temescal systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for evaporant reloading, cleaning, and maintenance. Access to the water manifold, the bellows-sealed high-vacuum valve, and other pumping system components is also simple and direct.

Key Features

  • Product chamber dimensions: 28″ high x 38″ x 38″
  • 25.5″ diameter source tray
  • Standard source-to-substrate distance: 34″
  • S-S distance with optional source well extension collar: 38″
  • Product and source chamber cryopumps

System Control

  • Temescal Control System (TCS), providing auto, manual, and service modes plus process datalogging
  • TCS-based process variable monitoring (PVM) allows user to set process tolerance alarms
  • Inficon XTC/3 deposition controller electron beam source, power supply, and sweep
  • Temescal removeable-cover turret source, 4- or 6-pocket
  • Temescal model CV-12SLX electron beam power supply
  • Temescal SuperSweep64 programmable beam sweep controller

Vacuum pumping and control

  • Edwards model iGX100L dry roughing pump, with a pumping speed of 62 cfm (105 m3/h-1)
  • Source chamber cryopump: CTI model CT-10 On-Board
  • Product chamber cryopump: CTI model CT-400 On-Board
  • Edwards active inverted magnetron gauges and Pirani controllers, monitored and controlled by the TCS
  • Cryopump temperature monitoring

Water System

  • Stainless steel manifold provides cooling water for source and product chamber components
  • Separate product chamber circuit for cold and optional hot water

Air System

  • PLC-controlled air manifold Load-Lock Systems Optimized for Lift- Off Applications (Gate, Ohmic, TFR)


  • 5 EMO switches
  • Standard 19-in.-wide electronics rack on casters
  • Surfaces exposed to high vacuum are made of 304 SST

Source Chamber

  • Drop-down, swing-out source tray, accessible from either front or left side of vacuum cubicle
  • Wide-angle 4-in. viewport for source observation
  • Removeable stainless-steel source tray debris shield
  • Gate valve with moveable shield
  • Source tray diameter: 25.5 in. (648 mm)

Product Chamber

  • 28 in. high x 38 in.2 (711 mm x 965 mm2)
  • Two sets of product chamber evaporation shields
  • Two blanked-off RGA ports
  • Left-side door for service access
  • Wide-angle viewports on front and left side
  • TP-8 90-angle-of-incidence substrate dome
  • One fixed uniformity mask

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