Temescal FC2000 / BJD-2000 Bell Jar Deposition System

Convertible Bell Jar for Small-Scale Production and R&D Applications

Temescal’s BJD-2000 and FC-2000 are versatile evaporation systems that accept a variety of accessories to meet almost any requirement. Engineered for efficient operation and clean room compatibility, these systems combine maximum flexibility with ease of use. The FC-2000 is a fast- cycle, load-locked system that allows the source to remain under vacuum during substrate reloading. The BJD-2000 is non-load-locked.

Convenient Maintenance

The offset pumping port, the hinged door panels, and the swingout source tray are high-value maintenance features in Temescal bell-jar systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for evaporant reloading, cleaning, and maintenance. Access to the water manifold, the bellows-sealed high-vacuum valve, and other pumping system components is also simple and direct.

Key Features

  • Non-load-locked BJD-2000 and load-locked FC-2000, both with a single cryopump
  • Source tray supports multiple electron beam and resistance sources
  • Standard source-to-substrate distance: 19.5″
  • S-S distance with optional source well extension collar: 27.5″
  • Field upgrade kit allows conversion into an FC-2800 or a BCD-2800

System

  • University, R&D, Pilot Production
  • Product Chamber Type: bell jar
  • FC-2000 Load lock to isolate Product Chamber
  • Cryopump water L/sec: 4,000
  • FC-2000 Pump down time: 1E-06 < 10mins
  • BJD-2000 Pump down time: 1E-06 < 15mins
  • E-gun (max pkg): 4x25cc PopTop + 1 fixed pocket
  • E-gun Power Supply: 6 or 12 kW
  • Ion gun: MKI filament
  • Max wafer count: Lift off 42×2″, 13x100mm
  • Source to Substrate: std 19.5″
  • Source to Substrate: ext 27.5″

System Control

  • Temescal Control System (TCS), with Auto, Manual modes plus process datalogging
  • Security code-based access for multiple classes of users
  • TCS-based process variable monitoring (PVM), allowing user to set tolerance alarms for critical process variables
  • 17″ high resolution color touch screen interface

E-Beam

  • Temescal 4- or 6-pocket Standard or PopTop turret source
  • Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
  • TemEBeam Contoller: Sweep, Index, Gun & HV

Substrate

  • Lift-off dome or dome frame with segments
  • Step coverage High Speed Planetary
  • Flip tooling: allows for two sided or edge coating
  • VAP: Variable Angle Planetary

Vacuum Pumping & Control

  • Market leading dry roughing pump >60 cfm (102 m3/h)
  • CTI On-Board Cryopumps
  • Cryopump temperature monitoring
  • Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS

Product Chamber

  • Dimensions in inches: 20 bell jar
  • FC-2000 Product chamber cryopump: CT-400 17,500 L/Sec
  • Water cooled product chamber walls
  • Two sets of product chamber evaporation shields
  • Wide-angle viewport on front of system
  • One fixed uniformity mask
  • Spare port(s) for RGA or alternate access

Source Chamber

  • Source chamber cryopump: CT-8, 4,000 L/Sec
  • FC-2000 Source Tray Dimensions in inches: 20
  • BJD-2000 Source Tray Dimensions in inches: 18
  • Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
  • Wide-angle 4” viewport
  • Removable stainless-steel source shields

Water & Air System

  • Stainless steel manifold provides cooling water for source and product chamber components
  • Separate product chamber circuit for cold and optional hot water
  • TCS-controlled auto-blowdown for turret source
  • PLC-controlled air manifold

System Wide

  • 3 EMO switches
  • Standard 19” wide electronics rack on casters
  • Surfaces exposed to high vacuum are made of 304 SST

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