Ferrotec

Convertible Bell Jar for Small-Scale Production and R&D Applications Temescal’s BJD-2000 and FC-2000 are versatile evaporation systems that accept a variety of accessories to meet almost any requirement. Engineered for efficient operation and clean room compatibility, these systems combine maximum flexibility with ease of use. The FC-2000 is a fast- cycle, load-locked system that allows …

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Mid-Sized Coaters for Production and Large-Wafer R&D Applications The Temscal FC-2800 and BCD-2800 are clean room-compatible coaters that offer high-throughput efficiency and lift-off capability at a source-to-substrate distance of either 34″ (866mm) or 42″ (1076mm). Both systems can be configured for either freestanding or through-the-wall clean room installation, and both support numerous combinations of deposition …

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Ideal for Production Lift-Off, Step-Coverage, and Dual-Sided Coating Applications The Temscal FC-3800 enables rapid processing of 150mm diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 150mm diameter wafers for lift off or thirty-six 150mm wafers for step coverage. The 38″ x 38″ x 28″ …

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Load Locked and Optimized for Lift-Off Processes The Temescal FC-4400 represents our ultimate classic-configuration, high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of thirty 150mm wafers per load via high capacity e-beam evaporation. The load locked, 44 inch x 44 inch x 28 inch product chamber can be pumped …

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Ultimate Uniformity in Lift-Off Processes, Optimized for 150mm Wafers The Temescal UEFC-4900 with Auratus is the compact version of the UEFC-5700. It represents the ultimate mid-sized coater for lift-off processes. The source-to-substrate distance and chamber angles in the UEFC-4900 have been optimized for 150mm wafers and the system supports 25 x 150mm wafers. The load …

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Ultimate Throughtput in Lift-Off Processes with 150mm or 200mm Wafers The Temescal UEFC-5700 with Auratus represents our ultimate high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of forty-two 150mm wafers per load via high capacity e-beam evaporation. The load locked product chamber can be pumped by as many as …

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