Q300T T Plus – triple target sputter coater for specimens up to 200mm diameter

Q300T T Plus – triple target sputter coater for specimens up to 200mm diameter

The Q300T T Plus is a large chamber, turbo-pumped coating system, ideally suited for sputtering a single large diameter specimen up to 8″/200mm or multiple smaller specimens over a similar diameter. Ideal for thin-film applications and SEM/FE-SEM. It is fitted with three sputtering heads to ensure even deposition of individual large specimens or multiple specimens.

NB: Please note it is not possible to sequentially sputter three different sputtering metals from each sputtering head – for sequential coating see the Q300T D Plus. 


  • Ultimate vacuum of 5 x 10-5 mbar or less possible
  • New touch and swipe capacitive screen
  • USB port for upgrades and download of process log files
  • Multiple-use profiles can be set up on one machine
  • New software sorts recipes per user according to recent use
  • 16GB of memory can store more than 1000 recipes
  • New multi-colour LED visual status indicator
  • Interchangeable stage options
  • Three sputter heads for larger area deposition of different materials

Recommended applications for Q300T T Plus:

  • Wafer Inspection
  • Multiple sample preparation for SEM

These products are for Research Use Only. 

Detachable chamber with built-in implosion guard

Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.

Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.

Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.

Triple Target Sputtering System

The Q300T T Plus is fitted with three individual sputtering heads to ensure even deposition of individual large specimens or multiple specimens. For economical coating of small specimens, ‘single target’ mode can be selected. They are ideal coaters for the preparation of large specimens for examination by SEM, FEG-SEM. To ensure even deposition, the Q300 Plus series of coaters are fitted with a rotating specimen stage and three individual magnetron target assemblies, which enhance the efficiency of the process by using low voltages.

Multiple stage options

The Q300T T Plus has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and the rotation speed is variable between pre-set limits.

Flat rotation stage for 200 mm/8” and 150 mm/6” wafers (fitted as standard).


The Q300T T Plus meets key industry CE standards

• All electronic components are protected by covers

• Implosion guard prevents user injury in event of chamber failure

• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened

• Overheating protection shuts down power supply

Vacuum control

High vacuum turbo pumping allows sputtering of a wide range of oxidising and non-oxidising metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation.  However, this is not suitable for electron microscopy applications because it can heat the sample and result in damage when the plasma interacts with the sample. The Q series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.

The Q300T T Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. The Q300T T Plus is fitted as standard with a chromium (Cr) sputter target. Other targets options include; Au, Au/Pd, Pt/Pd, Pd, Pt, Cu, Ir, W, ITO and Al etc.

Pulsed cleaning for aluminium sputtering

Aluminium (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T T Plus has a special recipe for aluminium that reduces the oxide removal time and prevents excessive pre-sputtering of the target.

Film thickness monitor     

The Q300T T Plus can be fitted with an optional film thickness monitor (FTM), which measures the coating thickness on a quartz crystal monitor within the chamber, in order to control the coating thickness of material deposited on to the sample.

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